Patents by Inventor Donald Herr

Donald Herr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfill encapsulants prepared from allylated amide compounds
    Patent number: 6350841
    Abstract: This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: February 26, 2002
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Rose Ann Schultz, Donald Herr, Chaodong Xiao
  • Allylated amide compounds and die attach adhesives prepared therefrom
    Publication number: 20010053863
    Abstract: Allylated amide compounds are formulated into curable compositions with a free radical curing agent, and optionally, one or more fillers, for use as adhesives in the manufacture of microelectronic devices.
    Type: Application
    Filed: June 29, 2001
    Publication date: December 20, 2001
    Inventors: Rose Ann Schultz, Donald Herr, Chaodong Xiao
  • Die attach adhesives for use in microelectronic devices
    Patent number: 6265530
    Abstract: A thermoplastic or thermosetting curable adhesive composition for bonding an electronic component to a substrate in which the adhesive is cured in situ comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: July 24, 2001
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Donald Herr, Rose Ann Schultz, Pingyong Xu, Scott R. McLaughlin