Patents by Inventor Donald I. Mead
Donald I. Mead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7101782Abstract: A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.Type: GrantFiled: January 11, 2006Date of Patent: September 5, 2006Assignee: International Business Machines CorporationInventors: Timothy A. Gosselin, Donald I. Mead
-
Patent number: 7037819Abstract: A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.Type: GrantFiled: October 15, 2004Date of Patent: May 2, 2006Assignee: International Business Machines CorporationInventors: Timothy A. Gosselin, Donald I. Mead
-
Patent number: 6818988Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.Type: GrantFiled: July 25, 2002Date of Patent: November 16, 2004Assignee: International Business Machines CorporationInventors: Timothy A. Gosselin, Donald I. Mead
-
Publication number: 20040016794Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.Type: ApplicationFiled: July 25, 2002Publication date: January 29, 2004Applicant: International Business Machines CorporationInventors: Timothy A. Gosselin, Donald I. Mead
-
Patent number: 6524888Abstract: Mixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity containing the semiconductor chip and a second cavity for containing the substrate. The substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.Type: GrantFiled: January 4, 2002Date of Patent: February 25, 2003Assignee: International Business Machines CorporationInventors: David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Miguel A. Jimarez, Li Li, Donald I. Mead
-
Patent number: 6513701Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.Type: GrantFiled: June 12, 2001Date of Patent: February 4, 2003Assignee: International Business Machines CorporationInventors: Donald I. Mead, Mark V. Pierson
-
Publication number: 20020096746Abstract: Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.Type: ApplicationFiled: January 4, 2002Publication date: July 25, 2002Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Miguel A. Jimarez, Li Li, Donald I. Mead
-
Patent number: 6337509Abstract: Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.Type: GrantFiled: July 16, 1998Date of Patent: January 8, 2002Assignee: International Business Machines CorporationInventors: David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Miguel A. Jimarez, Li Li, Donald I. Mead
-
Publication number: 20020000462Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.Type: ApplicationFiled: June 12, 2001Publication date: January 3, 2002Inventors: Donald I. Mead, Mark V. Pierson
-
Publication number: 20010019174Abstract: Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.Type: ApplicationFiled: July 16, 1998Publication date: September 6, 2001Inventors: DAVID N. COKELY, THOMAS M. CULNANE, LISA J. JIMAREZ, MIGUEL A. JIMAREZ, LI LI, DONALD I. MEAD
-
Patent number: 6173887Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. In another embodiment, a reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. In yet another embodiment, a reflective mask with apertures filled with solder paste is applied onto a substrate and then heated to cause localized solder melting. The mask and excess solder paste are removed.Type: GrantFiled: June 24, 1999Date of Patent: January 16, 2001Assignee: International Business Machines CorporationInventors: Donald I. Mead, Mark V. Pierson