Abstract: An improved ink jet printhead comprising upper and lower substrates that are mated and bonded together with a thick film insulative layer sandwiched therebetween. One surface of the upper substrate has etched therein one or more grooves and a recess which when mated with the lower substrate will serve as capillary filled ink channels and ink supply manifold, respectively. The grooves are open at one end and closed at the other. The open ends serve as nozzles. The manifold recess is adjacent the grooved closed ends. Each channel has a heating element located upstream of the nozzle. The heating elements are selectively addressable by input signals representing digitized data signals to produce ink vapor bubbles. The growth and collapse of the bubbles expel ink droplets from the nozzles and propel them to a recording medium.

Abstract: A large array ink jet printhead is disclosed having two basic parts, one containing an array of heating elements and addressing electrodes on the surface thereof, and the other containing the liquid ink handling system. At least the part containing the ink handling system is silicon and is assembled from generally identical sub-units aligned and bonded side-by-side on the part surface having the heating element array. Each channel plate sub-unit has an etched manifold with means for supplying ink thereto and a plurality of parallel ink channel grooves open on one end and communicating with the manifold at the other. The surfaces of the channel plate sub-units contacting each other are {111} planes formed by anisotropic etching. The channel plate sub-units appear to have a parallelogram shape when viewed from a direction parallel with and confronting the ink channel groove open ends.

Abstract: A method for separating chips formed on a silicon substrate is provided which uses a combination of reactive ion etching techniques combined with orientation etching to yield integrated chips having edges which can be more precisely butted together to form large area arrays.

Abstract: A thermal ink jet printhead of the type which expels droplets on demand towards a recording medium from nozzles located above and generally parallel with the bubble generating heating elements contained therein is disclosed, together with fabrication processes therefor. The droplets are propelled along trajectories that are perpendicular to the heating element surfaces and from nozzles located in the printhead roof; such configuration is generally referred to as "roofshooter". Each printhead comprises a silicon heater plate and a fluid directing structural member. The heater plate has a linear array of heating elements associated addressing electrodes, and an elongated ink fill hole parallel with the heating element array. The structural member contains at least one recessed cavity, a plurality of nozzles, and a plurality of parallel walls within the recessed cavity which define individual ink channels for directing ink to the nozzles.

Abstract: A plurality of thermal ink jet printheads are fabricated from two substrates, at least one of which is a (100) silcon wafer. A plurality of sets of heating element arrays are formed on one substrate, together with addressing electrodes for each heating element. A thick film insulative layer is placed over the heating elements and addressing electrodes which is patterned to remove the thick film from over the individual heating elements, placing them each in a recess, and the thermal end portions of the electrodes including the contact pads therefor. A plurality of ink supplying manifold recesses are anisotropically etched in the silicon wafer and a plurality of sets of channel grooves are formed, each set of which communicate with an associated manifold. The silicon wafer and heating element substrates are aligned and bonded together, so that each channel groove contains a heating element.

Abstract: A method of bonding ink jet printhead components together by coating a flexible substrate with a relatively thin, uniform layer of an adhesive having an intermediate non-tacky curing stage with a shelf life with around one month for ease of alignment of the parts and ease of storage of the components having the adhesive thereon. Transferring about half of the adhesive layer on the flexible substrate to the high points or lands of one of the printhead components within a predetermined time of the coating of the flexible substrate by placing it in contact therewith and applying a predetermined temperature and pressure to the flexible substrate prior to peeling it from the printhead component. This causes the adhesive to fail cohesively in the liquid state, assuring that about half of the thickness of the adhesive layer stays with the flexible substrate and is discarded therewith, leaving a very thin uniform layer of adhesive on the printhead component lands.

Abstract: An ink jet printhead having an internal, integrated filtering system and fabricating process therefor is disclosed. Each printhead is composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on a surface thereof a linear array of heating elements and addressing electrodes. The other part is a flat substrate having a set of concurrently etched recesses in one surface. The set of recesses include a parallel array of elongated recesses for use as capillary filled, ink channels having ink droplet emitting nozzles at one end and having interconnection with a common ink supplying manifold recess at the other ends. The manifold recess contains an internal, closed wall defining a chamber with an ink fill hole. Small passageways are formed in the internal chamber walls to permit passage of ink therefrom into the manifold.

Abstract: A continuous stream type ink jet printhead utilizing constant thermal pulses to perturbate the ink streams emitted through a plurality of nozzles to break up the ink streams into droplets at a fixed distance from the nozzles whereat the drops are individually charged by a charging electrode in accordance with digitized data signals. Each printhead has a manifold, a plurality of ink channels communicating at one end with the manifold and terminating at the other end with nozzles, and at least one resistor addressed by a predetermined frequency of current pulses for applying thermal pulses to the ink. In one embodiment, a resistor is positioned in each of the channels adjacent the nozzles and in another embodiment, a single resistor is located in the ink manifold. The resistors are pulsed at low power to generate a perturbation of ink properties such as density, viscosity, or surface tension without producing a phase change in the ink.

Abstract: Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations.

Abstract: Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations.