Abstract: Electrical connectors of the present invention include alignment guides that provide rough connector alignment, vary an electrical contact mating wipe distance, and provide partial separation between two mating electrical connectors. The alignment guides can be, for example, electrically insulative posts that are received in silos formed in the housings of the electrical connectors.

Abstract: A preferred embodiment of a connector system includes a first electrical connector for mounting on a first substrate. The first electrical connector has a housing, and a contact mounted on the housing. The connector system also includes a second electrical connector for mounting on a second substrate. The second electrical connector includes a housing having a projection formed thereon, and a contact mounted on the housing. The second electrical connector is capable of mating with the first electrical connector so that the contact of the first electrical connector electrically contacts the contact of the second electrical connector and the projection contacts the first substrate so that at least a portion of the weight of the second electrical connector and the second substrate is transmitted to the first substrate by way of the projection.

Abstract: Electrical connectors of the present invention include alignment guides that provide rough connector alignment, vary an electrical contact mating wipe distance, and provide partial separation between two mating electrical connectors. The alignment guides can be, for example, electrically insulative posts that are received in silos formed in the housings of the electrical connectors.

Abstract: An electrical assembly comprises an electrical connector, and an improved pickup cap that is provided with a surface area configuration that has the potential to impart a more even temperature distribution across the ball grid array during reflow. Some embodiments of the pickup cap, when connected to the electrical connector, cover the sides of the electrical connector, but do not cover the central portion of the electrical connector. Such a configuration of pickup cap surface areas has the potential to provide a more even temperature distribution across the grid of solder balls during reflow of the solder balls.

Abstract: An electrical assembly that may include a weighted cap. The weighted cap may provide counterbalancing to a non-proportional ball-grid array connector integrated circuit package for connection with a substrate. The weighted cap provides compensation for variations in the imbalance of the electronic connector package against the substrate.

Abstract: A preferred embodiment of a connector system includes a first electrical connector for mounting on a first substrate. The first electrical connector has a housing, and a contact mounted on the housing. The connector system also includes a second electrical connector for mounting on a second substrate. The second electrical connector includes a housing having a projection formed thereon, and a contact mounted on the housing. The second electrical connector is capable of mating with the first electrical connector so that the contact of the first electrical connector electrically contacts the contact of the second electrical connector and the projection contacts the first substrate so that at least a portion of the weight of the second electrical connector and the second substrate is transmitted to the first substrate by way of the projection.

Abstract: An electrical connector having a leadframe assembly and a connector housing is disclosed. The leadframe may include a lead frame and an electrical contact extending at least partially through the lead frame. The connector housing contains the leadframe assembly in each of one or more directions and also allows the leadframe assembly to move relative to the housing in the each direction. After the connector is mounted to a substrate, such as a printed circuit board, the housing is free to move in at least one direction relative to the leadframe assemblies. The connector may also include a contact receiving wafer having a face that at least partially defines an aperture that extends therethrough. A terminal portion of the contact may extend at least partially into the aperture. The faces that define the aperture contain the terminal portion of the contact in each of a plurality of directions and also allows the terminal portion of the contact to move in each direction.

Abstract: An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.

Abstract: An electrical contact assembly including a contact terminal and a fusible element. The contact terminal has a base and two cantilevered deflectable contact arms extending from at least one lateral side of the base. A first one of the contact arms extends in a downward direction and a second one of the contact arms extends in an upward direction. The fusible element is fixedly attached to an end of the first contact arm. The fusible element is adapted to be fused to a first pad on a first electronic component. The second contact arm comprises a surface contact area for contacting a second pad on a second electronic component. The first and second contact arms are adapted to deflect when the contact area of the second contact arm is contacted by the second pad of the second electronic component.

Abstract: An electrical connector contact strip including spaced electrical contacts, a body and fusible elements. The spaced electrical contacts each have a main section and a tab section extending from an end of the main section. The body includes dielectric material molded onto the contacts and connecting the contacts to each other. The fusible elements are mounted on the tab sections.

Abstract: An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.

Abstract: A connector is provided for reducing the effects of differential coefficient of thermal expansion of the connector and the underlying circuit board. The connector exhibits high coplanarity along the mounting interface by providing an insulative connector housing in which stress buildup is avoided. The connector housing incorporates compliant sections corresponding to the areas where the greatest deformation in the substrate is expected. The housing has notches or slots at locations furthest from the neutral point (NP) of the connector (i.e., around the corners). By means of this arrangement, stress buildup is avoided, so as to minimize warping and twisting of the housing.