Patents by Inventor Donald K. Harper, Jr.

Donald K. Harper, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6527597
    Abstract: A modular construction of connectors is provided for reducing the effects of the differential coefficient of thermal expansion of the connectors and the underlying circuit board. Each connector of the modular construction is mounted on a known circuit board or the like and could receive therein an integrated circuit chip carrier or could mount to another board. The principle of solder surface tension and self-centering characterized in ball grid array (BGA) surface mount technology is used to form an array connector having multiple components that form a larger array pattern or group of arrays.
    Type: Grant
    Filed: March 7, 2000
    Date of Patent: March 4, 2003
    Assignee: FCI Americas Technology, Inc.
    Inventor: Donald K. Harper, Jr.
  • Patent number: 6471526
    Abstract: An electrical connector is disclosed. The electrical connector comprises a plurality of contacts that are adapted to be electrically connected to a substrate. A first body of reflowable, electrically conductive material is placed on a contact in order to provide an electrical path between the connector and the substrate. In addition, a second body of reflowable, electrically conductive material is placed on another contact. This second body provides mechanical strain relief between the connector and the substrate.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: October 29, 2002
    Assignee: FCI Americas Technology, Inc.
    Inventor: Donald K. Harper, Jr.
  • Patent number: 6375474
    Abstract: An electrical connector comprising a housing having a first surface and a second surface; and a contact secured to the housing. The contact comprises a mounting section connected to the housing and, a first arm and a second arm extending from the mounting section. The mounting section comprises an aperture and a slit through the contact from the aperture and between the first and second arms. The first arm extends towards the first surface and the second arm extends towards the second surface.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: April 23, 2002
    Assignee: Berg Technology, Inc.
    Inventors: Donald K. Harper, Jr., Steven K. Forman
  • Patent number: 6354850
    Abstract: An insulative housing for an electrical connector, including: a base; and at least one aperture extending through said base for receiving a contact. The aperture has an enlarged opening at one end adapted to receive a fusible element for securing the connector to a substrate. The enlarged portion has a cross-sectional area, in one orientation, that can be larger than the cross-sectional areas of other orientations. An electrical connector housing, including: a base; and a plurality of apertures in the base for receiving a contact. Each aperture has a recess for receiving a portion of a fusible element therein. Each recess has a characteristic, with the characteristic of a portion of the recesses being different than the characteristic of the other recesses.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: March 12, 2002
    Assignee: FCI Americas Technology, Inc.
    Inventors: Donald K. Harper, Jr., Thomas D. Moyer, James A. Kopec
  • Patent number: 6353191
    Abstract: An electrical connector apparatus for establishing a connection between an electrical connector and a substrate. A column of solder is disposed about a tail portion of a terminal of the electrical connector to form a solder column. The solder column being adapted for making an electrical contact between the electrical connector and the substrate. Increasing the height of the solder column improves compliance in the connection between the terminal and the substrate. This feature of improved compliance allows the terminal to absorb higher stresses present between the substrate and the connector body thereby avoiding fracture of the solder joint between the terminal and the substrate. In addition, the terminal tail acts to reinforce the solder column and this metal core of the solder column increases the mechanical properties of the attachment between the connector body and the substrate. A method of forming the solder column is also disclosed.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: March 5, 2002
    Assignee: FCI Americas Technology, Inc.
    Inventor: Donald K. Harper, Jr.
  • Patent number: 6303991
    Abstract: An electronic package and contacts therefor are disclosed. The package includes a planar base and a plurality of conductive pads positioned on one planar side of the base. Each contact is formed as a generally unitary body from a conductive material, and is conductively coupled to a respective one of the pads. Each contact has a coupling tab and a longitudinally extending blade coupled to the tab. The tab extends along the respective pad and is coupled thereto. The blade extends perpendicularly with respect to the one planar side of the base.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: October 16, 2001
    Assignee: FCI Americas Technology, Inc.
    Inventors: Donald K. Harper, Jr., Timothy A. Lemke
  • Patent number: 6193537
    Abstract: A connector having a hermaphroditic contact is disclosed. Such hermaphroditic contact extends longitudinally and is formed as a unitary body from a conductive material. The contact has a base residing in a plane and extending longitudinally and traversely in the plane, a blade arm extending longitudinally from the base and generally in the plane of the base, and a spring arm extending longitudinally from the base alongside the blade arm. The spring arm is springingly displaceable toward at least a first side of the plane of the base. To electrically couple first and second generally identical ones of the contact, the bases of the first and second contacts are aligned to be co-planar, and the blade arm of the each contact is aligned to face toward the spring arm of the other contact. The first and second contacts are then moved together such that the blade arm of each contact encounters the spring arm of the other contact.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: February 27, 2001
    Assignee: Berg Technology, Inc.
    Inventors: Donald K. Harper, Jr., Lewis R. Johnson
  • Patent number: 6193523
    Abstract: A contact for use in an electrical connector that interconnects a first circuit substrate and a second circuit substrate. The contact can have an intermediate portion; a mounting portion extending from the intermediate portion for securing the contact to the first circuit substrate; and a mating portion extending from the intermediate portion and adapted to provide a non-linear wiping action to the second circuit substrate upon deflection of the mating portion by the second circuit substrate. The contact may be formed from a sheet of material and comprises: a mounting portion for mounting the connector to a first circuit substrate; and a mating portion for engaging a second circuit substrate. The mating portion has an edge that engages the second circuit substrate.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: February 27, 2001
    Assignee: Berg Technology, Inc.
    Inventor: Donald K. Harper, Jr.
  • Patent number: 5531602
    Abstract: An adapter assembly (20) for electrical connection between a small outline integrated circuit (SOIC) (25) and a remote receptacle connector (87) via a cable including a plurality of electrical conductors (23) comprises a nonconductive adapter housing (21) providing a plurality of spaced-apart slots (39) for receiving a plurality of contacts (22). The SOIC (25) being received in a cavity (50) at the bottom of the adapter housing (21), is retained within the cavity (50) by retention teeth (57) engaging respective side retention areas (54) located between each two adjacent leads (24) of the SOIC (25), and by a pair of retention members (55) engaging respective end retention areas (56) of the SOIC (25). A removable clip (26) is locked over the adapter housing (21). Each contact (22) being received in the respective slot (39), engages a respective lead (24) of the SOIC (25) by its lower portion (61). An upper portion (62) of each contact (22) terminates the respective electrical conductor (23).
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: July 2, 1996
    Assignee: The Whitaker Corporation
    Inventors: Donald K. Harper, Jr., Michael F. Laub, James P. Pacelli, William J. Schnoor
  • Patent number: 5412540
    Abstract: The contacts extending from the four sides of a flat-pack are releasably held against corresponding contacts extending from the sides of a socket for the flat-pack, by means of a cover comprising four arms pivotally mounted on the socket each near one of its four corners; by pivoting the arms downwardly against the tops of the flat-pack contacts, these contacts are pressed against, and held in positive contact with, the underlying socket contacts, and by pivoting the arms upwardly, the flat-pack can be released for removal and subsequent replacement. In addition, the cover is usefully mounted in position on the flat-pack even when the flat-pack is free of the socket, in which use it serves to protect the leads of the flat-pack in handling and during storage, for example.
    Type: Grant
    Filed: July 20, 1993
    Date of Patent: May 2, 1995
    Assignee: The Whitaker Corporation
    Inventors: Arkadiy Y. Golubchik, Donald K. Harper, Jr., Michael F. Laub, David W. McMullen
  • Patent number: 5314223
    Abstract: A system for conveying chips from a container to a predetermined position on top of a chip socket. A vacuum-held hand tool having a handle is supplied with a vacuum or with a positive air pressure at its working face, as controlled by placement of a digit of the operator with respect to an air exhaust port on the handle. The bottom or working face of the tool is provided with a recess fitting the outline of a chip to be picked up by the tool working face, to hold the chip fixed on the tool as it is carried by the tool to a position atop the socket, where it is discharged by flow of air from the working face when a digit of the operator is applied to the exhaust port of the tool.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: May 24, 1994
    Assignee: The Whitaker Corporation
    Inventors: Donald K. Harper, Jr., Michael F. Laub