Abstract: A parallel diagnostic/software installation system includes a computing device, a server device storing computing device software, and a software staging device that is coupled to the server device through a first connection that provides a first maximum transmission rate, and that is coupled to the computing device through a second connection that provides a second maximum transmission rate that is faster than the first transmission maximum rate. The software staging device receives a manifest of computing device software for installation on the computing device and then retrieves, from the server device through the first connection, at least a portion of the computing device software while the computing device is performing a diagnostic test on a first hardware configuration of the computing device. The software staging devices determines that the diagnostic test has completed and, in response, provides, to the computing device through the second connection, the computing device software.

Abstract: A parallel diagnostic/software installation system includes a computing device, a server device storing computing device software, and a software staging device that is coupled to the server device through a first connection that provides a first maximum transmission rate, and that is coupled to the computing device through a second connection that provides a second maximum transmission rate that is faster than the first transmission maximum rate. The software staging device receives a manifest of computing device software for installation on the computing device and then retrieves, from the server device through the first connection, at least a portion of the computing device software while the computing device is performing a diagnostic test on a first hardware configuration of the computing device. The software staging devices determines that the diagnostic test has completed and, in response, provides, to the computing device through the second connection, the computing device software.

Abstract: An electronic package is mounted by its leads in an inner hermetically sealed package in an atmosphere of dry nitrogen gas at about 50 torr gas pressure. Leads extend through hermetically sealed electric feedthroughs into an outer enclosure which is maintained at a vacuum of at least 1.times.10.sup.-4 torr. Electrical leads which extend substantially the entire length of the interior space of the outer enclosure pass out of the outer enclosure at first ends of the leads through hermetically sealed electrical feed-throughs and at second ends electrically communicate with and structurally support the leads from the inner enclosure so that the inner enclosure is disposed between the first and second ends. The surfaces of the inner enclosure and the interior surface of the outer enclosure are electropolished.The electronic package consists of a central core sandwiched between beryllium oxide heat spreaders on which are mounted heaters in the form of power transistors.