Abstract: A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermoelectric elements, and by the use of a flexile joint to attach a second substrate to the remainder of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions.

Abstract: A new and improved thermoelectric device and a method of manufacturing same takes advantage of the anisotropy of the materials employed to provide a substantially increased power output over prior art devices. The individual thermoelectric elements are pressed using techniques such as those employed in powdered metallurgy and electrically coupled such that a current path is established through the elements in a direction substantially perpendicular to the direction of pressing.The method and device of the present invention also achieve a substantially thinner device than was previously possible with no concomitant sacrifice in individual thermoelectric element integrity or increased resistance of the electrical connections between the individual thermoelectric elements. The individual thermoelectric elements are dimensioned such that each has a first dimension substantially greater than either its second or third dimensions.