Abstract: The present invention is a device which includes an antenna and circuitry. The antenna may receive a circularly-polarized signal as first and second linearly-polarized signals. The circuitry is connected to the antenna and is configured for combining the first and second linearly-polarized signals to produce at least two reception patterns. The reception patterns are created by summing the first and second linearly-polarized signals via phase shifting. The reception patterns are optimized for at least two substantially different directional orientations. Further, the antenna may simultaneously allow/provide spec-compliant Global Positioning System operation and spec compliant Height of Burst operation.

Abstract: In one embodiment, a printhead assembly includes: an ink reservoir; a printhead; a passage for carrying ink from the ink reservoir to the printhead; and a port from the passage to a source of air pressure. The port is operable between a closed position in which the passage is not pressurized with air and an open position in which the passage is exposed to pressurized air. In another embodiment, an ink supply includes: a reservoir for holding ink; a printhead; a standpipe connecting the reservoir and the printhead such that ink may flow from the reservoir to the printhead through the standpipe; and a valve operatively connected to the standpipe. The valve is operative between a first position in which the standpipe is pressurized with air and a second position in which of the standpipe is not pressurized with air.

Abstract: One embodiment of a method of storing a printhead includes opening a valve to a vent of an ink reservoir, operating a pump in a first direction to pull ink from the ink reservoir through said valve, and pumping the ink pulled from the ink reservoir to an ink supply container.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: One embodiment of a method of storing a printhead includes opening a valve to a vent of an ink reservoir, operating a pump in a first direction to pull ink from the ink reservoir through said valve, and pumping the ink pulled from the ink reservoir to an ink supply container.

Abstract: A valve mechanism and a method for preparing an inkjet print cartridge and printer for inactivity is herein disclosed. Pressurized fluid is introduced to a standpipe volume to create a pressure differential that forces ink within the standpipe into an ink reservoir.

Abstract: A method of operating an arc discharge lamp that has first and second electrodes is described. First, the first electrode is heated with a third electrode with a first arc until the first electrode temperature is sufficiently elevated to allow for thermionic emission. Then, a first voltage is applied between the first and second electrode at a voltage less than 1000 volts to create a second arc.

Abstract: An inkjet printhead and a method for increasing the shelf life thereof are herein disclosed. The inkjet printhead has one or more nozzles for dispensing a colorant. These nozzles are fluidically connected to a reservoir. A first colorant substantially fills the nozzles while a second colorant is reserved in the reservoir.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A method of removing gas from a printhead is provided. A sealing material may be applied to orifices of a printhead from external the printhead to restrict passage of fluid through the orifices. Ink may be moved through a printhead conduit disposed in fluid communication with the orifices to create an inward suction adjacent the orifices so that the gas is displaced from adjacent the orifices.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: Disclosed is a pigmented fluid delivery system for an inkjet printing system. The pigmented fluid delivery system comprises a first printer component and at least a second printer component. The first printer component has a fluid outlet in fluid communication with a supply of pigmented fluid defined by particles suspended in a carrier fluid. The second printer component has a fluid inlet releasably connectable to the fluid outlet of the first printer component. The fluid inlet includes a filter compatible with the supply of pigmented fluid. The filter is an open weave screen defining a plurality of pores. The pores are sized to allow passage of the pigmented fluid while preventing clogging from flocculation of the particles and evaporation of the carrier fluid.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: Disclosed is a pigmented fluid delivery system for an inkjet printing system. The pigmented fluid delivery system comprises a first printer component and at least a second printer component. The first printer component has a fluid outlet in fluid communication with a supply of pigmented fluid defined by particles suspended in a carrier fluid. The second printer component has a fluid inlet releasably connectable to the fluid outlet of the first printer component. The fluid inlet includes a filter compatible with the supply of pigmented fluid. The filter is an open weave screen defining a plurality of pores. The pores are sized to allow passage of the pigmented fluid while preventing clogging from flocculation of the particles and evaporation of the carrier fluid.

Abstract: A flexible frame onsert molded capping system has an elastomeric sealing lip onsert molded onto a flexible, flat, springy support frame, preferably with series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads. The frame has a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead, even when the orifice plates of adjacent printheads are not in a coplanar alignment. Use of a single piece frame, and onsert molding of the cap lips thereon, decreases the number of parts required to assemble an inkjet printing mechanism, leading to a more economical unit which is easier to assemble.

Abstract: A foam-filled cap sealing ink-ejecting nozzles of an inkjet printhead in a printing mechanism has a two-layer structure, with an outer skin layer of an elastomer, and a second foam core layer inside the skin. The skin defines a sealing lip that surrounds the nozzles when the cap is in a sealing position to avoid unnecessary drying of the ink. The skin has an interior surface that defines a cavity under the sealing lip. The foam core, located within the cavity, may be formed by expanding a foam preform or by injecting raw foam into the cavity. An insert may be molded into the cap structure for use in mounting the cap in the printing mechanism. An optional backing layer molded to the structure is used to attach a vent basin to the cap. A method of constructing this cap, and a printing mechanism having this cap, are also described.

Abstract: A high deflection capping system has an elastomeric sealing member with a sealing lip that, when viewed in cross section, forms a smiling-shaped seal against an inkjet printhead to provide improved printhead sealing, particularly when sealing over surface irregularities on the printhead. This high deflection sealing member may be onsert molded onto a support frame. A series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads, with the flexible frame having a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead. Alternatively, the support frame may be designed to support only a single high deflection sealing member. A venting system is also provided with vapor diffusion handling capabilities.

Abstract: A wet-wiping printhead cleaning system including a treatment fluid applicator placing treatment fluid on at least one of two elements involved in wiping, said two elements being a printhead orifice plate surface and a wiper, the system being so configured that treatment fluid is applied before wiping the printhead by projecting treatment fluid onto at least one element through the atmosphere, thereby avoiding direct contact between the applicator and said one element, the treatment fluid being placed so as to be available to assist in wiping a portion of the printhead orifice plate where the nozzle orifices are located to remove debris that may have accumulated, the treatment fluid lubricating the wiper so as to lengthen wiper service life and enhance wiping performance, as well as acting to render such accumulations more removable by wiping, the source of treatment fluid being uncontaminated by contact with either the printhead or the wiper.