Patents by Inventor Donald L. Smith
Donald L. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7141285Abstract: This invention relates to a composite construction for use as a label or a tape to be adhered to a second substrate comprising a rubber-based material (e.g., vehicular tire), said composite construction comprising: a first substrate (e.g., paper, polymer film or combination thereof), said first substrate having a face side and an underside opposite said face side; an adhesive layer; and a barrier layer adhered to the underside of said first substrate and positioned between said first substrate and said adhesive layer, said barrier layer comprising a radiation cured acrylated epoxy derived from at least one acrylated epoxy oligomer and at least one reactive diluent selected from N-vinyl-2-pyrrolidone and N-vinylcaprolactam, said barrier layer being substantially impervious to migratory components in said adhesive layer and said second substrate. In one embodiment, a release liner is adhered to the adhesive layer. In one embodiment, the composite construction is adhered to the second substrate.Type: GrantFiled: October 15, 2003Date of Patent: November 28, 2006Assignee: Avery Dennison CorporationInventors: Wayne Louis Bilodeau, Gregory P. Brumbaugh, Donald L. Smith
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Patent number: 7032322Abstract: A processor and method for treating infectious waste utilizes a processing chamber having an inlet for delivering processing water at an elevated temperature and under pressure into the processing chamber, an opening in the processing chamber for receiving of infectious waste and for removing treated waste, an agitator for opening the waste material to the action of the water at elevated temperature and pressure. A basket and/or a sieve may be carried in the processing chamber to facilitate drainage of spent processing water, and an apparatus may be included for removing neutralized waste through the opening in the processing chamber either by inverting the processor or by removing and inverting the basket and/or sieve.Type: GrantFiled: November 4, 2004Date of Patent: April 25, 2006Assignee: Sterassure Solutions, L.L.C.Inventor: Donald L. Smith
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Patent number: 7000315Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.Type: GrantFiled: March 11, 2003Date of Patent: February 21, 2006Assignee: Xerox CorporationInventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
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Patent number: 6947291Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.Type: GrantFiled: May 23, 2002Date of Patent: September 20, 2005Assignee: Xerox CorporationInventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
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Patent number: 6922327Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.Type: GrantFiled: October 11, 2001Date of Patent: July 26, 2005Assignee: Xerox CorporationInventors: Christopher L. Chua, Eric Peeters, Koenraad F. Van Schuylenbergh, Donald L. Smith
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Patent number: 6856225Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.Type: GrantFiled: May 17, 2000Date of Patent: February 15, 2005Assignee: Xerox CorporationInventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
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Publication number: 20030228679Abstract: The invention provides inoculants for increasing plant growth, comprising plant growth promoting bacteria selected from the group consisting of plant growth promoting bacteria of the species Bacillus subtilis and plant growth promoting bacteria of the species Bacillus thuringiensis, or a combination thereof, and methods for using the inoculants for increasing plant growth. Preferably the plant growth promoting bacteria are selected from the group consisting of B. subtilis having the identifying characteristics of B. subtilis strain NEB4, B. subtilis having the identifying characteristics of B. subtilis strain NEB5, and B. thuringiensis having the identifying characteristics of B. thuringiensis strain NEB17.Type: ApplicationFiled: March 26, 2003Publication date: December 11, 2003Inventors: Donald L. Smith, Brian Driscoll, Yuming Bai
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Publication number: 20030179064Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.Type: ApplicationFiled: March 11, 2003Publication date: September 25, 2003Applicant: Xerox CorporationInventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
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Patent number: 6606235Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.Type: GrantFiled: May 23, 2002Date of Patent: August 12, 2003Inventors: Christopher L. Chua, Eric Peeters, Koenraad F. Van Schuylenbergh, Donald L. Smith
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Publication number: 20030096375Abstract: Lipo-chito oligosaccharides (LCOs) are produced by culturing rhizobacteria cells in or on a culture medium comprising at least one of: jasmonic acid or a derivative thereof; linoleic acid or a derivative thereof; or linolenic acid or a derivative thereof. Preferably, the rhizobacteria cells are Bradyrhizobium japonicum cells having the identifying characteristics of B. japonicum strain USDA 3. Preferably, the derivative of jasmonic acid is an ester thereof, preferably methyl jasmonate. Also provided are methods for improving LCO production at low temperatures, particularly temperatures below 25° C.Type: ApplicationFiled: May 16, 2002Publication date: May 22, 2003Inventors: Donald L. Smith, Fazli Mabood, Hao Zhang
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Publication number: 20030030965Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.Type: ApplicationFiled: May 23, 2002Publication date: February 13, 2003Applicant: Xerox CorporationInventors: Christopher L. Chua, Eric Peeters, Koenraad F. Van Schuylenbergh, Donald L. Smith
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Publication number: 20030027081Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.Type: ApplicationFiled: May 23, 2002Publication date: February 6, 2003Applicant: Xerox CorporationInventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
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Patent number: 6513909Abstract: A method of forming and moving ink drops across a gap between a print head and a print medium, or intermediate print medium, in a marking device includes generating an electric field, forming the ink drops adjacent the print head and controlling the electric field. The electric field is generated to extend across the gap. The ink drops are formed in an area adjacent the print head. The electric field is controlled such that an electrical attraction force exerted on the formed ink drops by the electric field is the greatest force acting on the ink drops. The marking device may be incorporated into a transfuse printing system having an intermediate print medium made of one or more materials that allow for lateral dissipation of electrical charge from the incident ink drops.Type: GrantFiled: March 30, 1999Date of Patent: February 4, 2003Assignee: Xerox CorporationInventors: Scott A. Elrod, Vittorio Castelli, Meng H. Lean, Gregory J. Kovacs, John S. Berkes, Joy Roy, Donald L. Smith, Richard G. Stearns
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Patent number: 6464337Abstract: This invention relates to a method and apparatus for acoustic ink printing using a bilayer configuration. More particularly, the invention concerns an acoustically actuated droplet emitter which is provided with a continuous, high velocity, laminar flow of cooling liquid in addition to a stagnant pool of liquid to be emitted as droplets.Type: GrantFiled: January 31, 2001Date of Patent: October 15, 2002Assignee: Xerox CorporationInventors: Joy Roy, Scott A. Elrod, Donald L. Smith, Jerry Elkin, John S. Fitch
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Publication number: 20020101478Abstract: This invention relates to a method and apparatus for acoustic ink printing using a bilayer configuration. More particularly, the invention concerns an acoustically actuated droplet emitter which is provided with a continuous, high velocity, laminar flow of cooling liquid in addition to a stagnant pool of liquid to be emitted as droplets.Type: ApplicationFiled: January 31, 2001Publication date: August 1, 2002Applicant: XEROX CORPORATIONInventors: Joy Roy, Scott A. Elrod, Donald L. Smith, Jerry Elkin, John S. Fitch
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Publication number: 20020080554Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.Type: ApplicationFiled: October 11, 2001Publication date: June 27, 2002Applicant: Xerox Corporation.Inventors: Christopher L. Chua, Eric Peeters, Koenraad F. Schuylenbergh, Donald L. Smith
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Patent number: 6396677Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.Type: GrantFiled: May 17, 2000Date of Patent: May 28, 2002Assignee: Xerox CorporationInventors: Christopher L. Chua, Eric Peeters, Koenraad F. Van Schuylenbergh, Donald L. Smith
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Patent number: 6355176Abstract: An assembly and method for collecting and releasing magnetic materials includes an elongated permanent magnet (A) within an elongated cover (B) constructed from non-magnetic material for providing a collection area for the magnetic materials thereon opposite the magnet. Apparatus (C) separates the magnet to a more remote position in relation to the collection area for releasing magnetic materials from the elongated cover. The magnet and the cover may be moved while in superposed closely adjacent relation for collecting magnetic material and thereafter separated for releasing magnetic material collected on the cover. A driven conveyor (D) may be included Ln the assembly for transporting the magnet and the cover through a coolant liquid containing magnetic materials in the form of particulate matter formed during a machining operation.Type: GrantFiled: March 31, 2000Date of Patent: March 12, 2002Assignee: Insul-Magnetics, IncorporatedInventors: William R. Schaaf, Ray R. Arel, Donald L. Smith
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Patent number: 6352454Abstract: A spring contact includes a free portion having a tip. The free portion includes a contact surface and side surfaces. In some embodiments, a wear resistant material is formed on only selected portions of the tip. In other embodiments, the wear resistant material is formed on the contact surface and on the side surfaces. The wear resistant material increases the wear resistance of the spring contact. The spring contacts can be used in probes.Type: GrantFiled: October 20, 1999Date of Patent: March 5, 2002Assignee: Xerox CorporationInventors: Patrick G. Kim, Donald L. Smith, Andrew S. Alimonda
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Patent number: 6276779Abstract: This invention relates to an improved acoustic fluid emission head, e.g. an acoustic ink printhead, and a method of forming or assembling same. More particularly, the invention is directed to an acoustic ink printhead that advantageously incorporates elastomer gaskets to replace all epoxy joints in the printhead and a corrugated spacer to provide focal gap control in the printhead. A related method for manufacturing the printhead includes folding and spot welding the aperture plate of the printhead to maintain the elastomer gaskets in place and, consequently, control the focal gap.Type: GrantFiled: November 24, 1999Date of Patent: August 21, 2001Assignee: Xerox CorporationInventor: Donald L. Smith