Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: Described herein are articles composed of coatings with improved gamma radiation shielding and physical properties. In one aspect, the article is composed of a coating, where the coating includes a first layer composed of a first Z grade material, a second layer composed of a second Z grade material, and a third layer composed of a third Z grade material, wherein the atomic number of the first Z grade material and the third Z grade material is less than the atomic number of the second Z grade material. In one aspect, the substrate of the article is a textile. Methods for making the articles described herein are also provided.

Abstract: A radiation shielded vault structure includes a rigid outer structure comprising a plurality of rigid structural components that are interconnected at elongated joints to define an interior space. The structural components include a layer of lower atomic number (Z) material such as aluminum alloy and one or more layers of higher atomic number (Z) material titanium and/or tantalum. The vault structure may include radiation shield members extending along the elongated joints to provide radiation shielding at the elongated joints. The shield members comprise a higher atomic number (Z) material such as titanium or tantalum. The rigid structural components may comprise plate members that are interconnected along side edges thereof. End plates may be attached to the plate members to close off the interior space.

Abstract: A radiation shielded vault structure includes a rigid outer structure comprising a plurality of rigid structural components that are interconnected at elongated joints to define an interior space. The structural components include a layer of lower atomic number (Z) material such as aluminum alloy and one or more layers of higher atomic number (Z) material titanium and/or tantalum. The vault structure may include radiation shield members extending along the elongated joints to provide radiation shielding at the elongated joints. The shield members comprise a higher atomic number (Z) material such as titanium or tantalum. The rigid structural components may comprise plate members that are interconnected along side edges thereof. End plates may be attached to the plate members to close off the interior space.

Abstract: Aspects relate to building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Abstract: Aspects relate to methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: A radiation shielded vault structure includes a rigid outer structure comprising a plurality of rigid structural components that are interconnected at elongated joints to define an interior space. The structural components include a layer of lower atomic number (Z) material such as aluminum alloy and one or more layers of higher atomic number (Z) material titanium and/or tantalum. The vault structure may include radiation shield members extending along the elongated joints to provide radiation shielding at the elongated joints. The shield members comprise a higher atomic number (Z) material such as titanium or tantalum. The rigid structural components may comprise plate members that are interconnected along side edges thereof. End plates may be attached to the plate members to close off the interior space.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: A radiation-shielded structural enclosure is formed from layers of material having higher and lower Z (atomic) numbers. The enclosure may be formed from layers of titanium that are bonded to opposite sides of a layer of tantalum. A layer of aluminum alloy may be bonded to at least one of the layers of titanium. The enclosure provides structural support for components disposed inside the enclosure and provides radiation shielding for the components.

Abstract: A radiation shielded vault structure includes a rigid outer structure comprising a plurality of rigid structural components that are interconnected at elongated joints to define an interior space. The structural components include a layer of lower atomic number (Z) material such as aluminum alloy and one or more layers of higher atomic number (Z) material titanium and/or tantalum. The vault structure may include radiation shield members extending along the elongated joints to provide radiation shielding at the elongated joints. The shield members comprise a higher atomic number (Z) material such as titanium or tantalum. The rigid structural components may comprise plate members that are interconnected along side edges thereof. End plates may be attached to the plate members to close off the interior space.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Abstract: A radiation-shielded structural enclosure is formed from layers of material having higher and lower Z (atomic) numbers. The enclosure may be formed from layers of titanium that are bonded to opposite sides of a layer of tantalum. A layer of aluminum alloy may be bonded to at least one of the layers of titanium. The enclosure provides structural support for components disposed inside the enclosure and provides radiation shielding for the components.

Abstract: Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Abstract: A flexible thin metal film thermal sensing system is provided. A thermally-conductive film made from a thermally-insulating material is doped with thermally-conductive material. At least one layer of electrically-conductive metal is deposited directly onto a surface of the thermally-conductive film. One or more devices are coupled to the layer(s) to measure an electrical characteristic associated therewith as an indication of temperature.