Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: Built-in self-test (BIST) microcontroller integrated circuit adapted for logic verification. Microcontroller includes a plurality of hardware description language files representing a hierarchical description of the microcontroller, the plurality of hardware description language files including a library of circuit design elements, a plurality of library design circuit elements adapted to store a uniquely defined set of input and output signals to enable a logic BIST, and a plurality of latches adapted to store a plurality of values corresponding to a behavioral profile of a test clock.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: Built-in self-test (BIST) microcontroller integrated circuit adapted for logic verification. Microcontroller includes a plurality of hardware description language files representing a hierarchical description of the microcontroller, the plurality of hardware description language files including a library of circuit design elements, a plurality of library design circuit elements adapted to store a uniquely defined set of input and output signals to enable a logic BIST, and a plurality of latches adapted to store a plurality of values corresponding to a behavioral profile of a test clock.

Abstract: Built-in self-test (BIST) microcontroller integrated circuit adapted for logic verification. Microcontroller includes a plurality of hardware description language files representing a hierarchical description of the microcontroller, the plurality of hardware description language files including a library of circuit design elements, a plurality of library design circuit elements adapted to store a uniquely defined set of input and output signals to enable a logic BIST, and a plurality of latches adapted to store a plurality of values corresponding to a behavioral profile of a test clock.

Abstract: The invention provides a circuit that can observe data within shift registers without altering the data. The circuit includes selectors connected to the inputs and outputs of the shift registers. The selectors selectively connect the input with the output of a selected shift register to form a wiring loop for the selected shift register. A control device connected to the wiring loop uses the wiring loop to cause the data to be continually transferred from the output of the selected shift register to the input of the selected shift register and back through the selected shift register in a circular manner. The control device includes a counter used for determining the length of a selected shift register and a set of registers to store, for future use when rotating data in the shift registers, the length of each shift register. The control device also includes a data output accessible from outside the circuit.

Abstract: A design structure for a system for and method of performing high speed memory diagnostics via built-in-self-test (BIST) is disclosed. In particular, a test system includes a tester for testing an integrated circuit that includes a BIST circuit and a test control circuit. The BIST circuit further includes a BIST engine and fail logic for testing an imbedded memory array. The test control circuit includes three binary up/down counters, a variable delay, and a comparator circuit. A method of performing high speed memory diagnostics via BIST includes, but is not limited to, presetting the counters of the test control circuit, presetting the variable delay to a value that is equal to the latency of the fail logic, setting the BIST cycle counter to decrement mode, presetting the variable delay to zero, re-executing the test algorithm and performing a second test operation of capturing the fail data, and performing a third test operation of transmitting the fail data to the tester.

Abstract: A system and method for performing high speed memory diagnostics via built-in-self-test (BIST). A test system includes a tester for testing an integrated circuit that includes a BIST circuit and a test control circuit. The BIST circuit further includes a BIST engine and fail logic for testing an imbedded memory array. The test control circuit includes three binary up/down counters, a variable delay, and a comparator circuit. A method includes presetting the counters of the test control circuit, presetting the variable delay to a value that is equal to the latency of the fail logic, setting the BIST cycle counter to decrement mode, presetting the variable delay to zero, re-executing the test algorithm, performing a second test operation of capturing the fail data, and performing a third test operation of transmitting the fail data to the tester.

Abstract: The invention provides a circuit that can observe data within shift registers without altering the data. The circuit includes selectors connected to the inputs and outputs of the shift registers. The selectors selectively connect the input with the output of a selected shift register to form a wiring loop for the selected shift register. A control device connected to the wiring loop uses the wiring loop to cause the data to be continually transferred from the output of the selected shift register to the input of the selected shift register and back through the selected shift register in a circular manner. The control device includes a counter used for determining the length of a selected shift register and a set of registers to store, for future use when rotating data in the shift registers, the length of each shift register. The control device also includes a data output accessible from outside the circuit.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: Built-in self-test (BIST) microcontroller integrated circuit adapted for logic verification. Microcontroller includes a plurality of hardware description language files representing a hierarchical description of the microcontroller, the plurality of hardware description language files including a library of circuit design elements, a plurality of library design circuit elements adapted to store a uniquely defined set of input and output signals to enable a logic BIST, and a plurality of latches adapted to store a plurality of values corresponding to a behavioral profile of a test clock.

Abstract: Built-in self-test (BIST) microcontroller integrated circuit adapted for logic verification. Microcontroller includes a plurality of hardware description language files representing a hierarchical description of the microcontroller, the plurality of hardware description language files including a library of circuit design elements, a plurality of library design circuit elements adapted to store a uniquely defined set of input and output signals to enable a logic BIST, and a plurality of latches adapted to store a plurality of values corresponding to a behavioral profile of a test clock.

Abstract: The invention provides a circuit that can observe data within shift registers without altering the data. The circuit includes selectors connected to the inputs and outputs of the shift registers. The selectors selectively connect the input with the output of a selected shift register to form a wiring loop for the selected shift register. A control device connected to the wiring loop uses the wiring loop to cause the data to be continually transferred from the output of the selected shift register to the input of the selected shift register and back through the selected shift register in a circular manner. The control device includes a counter used for determining the length of a selected shift register and a set of registers to store, for future use when rotating data in the shift registers, the length of each shift register. The control device also includes a data output accessible from outside the circuit.

Abstract: An arrangement that will provide multiple communication paths for the simultaneously testing of a plurality of un-diced chips on a semiconductor wafer that will simultaneously permit each such communication path to service more than one chip while using a minimum number of tester contacts. These and other objects, features and advantages of the present invention are accomplished in a semiconductor wafer having thereon a number of kerf isolated integrated chips, each of said chips being coupled to at least two different ones of strategically placed administration circuits via two different stimulus buses; each chip being coupled to each administration circuit via selection control circuits laid down in the kerf area between the chips. It is this redundancy that significantly reduces the possibility of failure associated administration or selection control circuits.

Abstract: A design structure for a system for and method of performing high speed memory diagnostics via built-in-self-test (BIST) is disclosed. In particular, a test system includes a tester for testing an integrated circuit that includes a BIST circuit and a test control circuit. The BIST circuit further includes a BIST engine and fail logic for testing an imbedded memory array. The test control circuit includes three binary up/down counters, a variable delay, and a comparator circuit. A method of performing high speed memory diagnostics via BIST includes, but is not limited to, presetting the counters of the test control circuit, presetting the variable delay to a value that is equal to the latency of the fail logic, setting the BIST cycle counter to decrement mode, presetting the variable delay to zero, re-executing the test algorithm and performing a second test operation of capturing the fail data, and performing a third test operation of transmitting the fail data to the tester.

Abstract: An arrangement that will provide multiple communication paths for the simultaneously testing of a plurality of un-diced chips on a semiconductor wafer that will simultaneously permit each such communication path to service more than one chip while using a minimum number of tester contacts. These and other objects, features and advantages of the present invention are accomplished in a semiconductor wafer having thereon a number of kerf isolated integrated chips, each of said chips being coupled to at least two different ones of strategically placed administration circuits via two different stimulus buses; each chip being coupled to each administration circuit via selection control circuits laid down in the kerf area between the chips. It is this redundancy that significantly reduces the possibility of failure associated administration or selection control circuits.

Abstract: A system for and method of performing high speed memory diagnostics via built-in-self-test (BIST) is disclosed. In particular, a test system includes a tester for testing an integrated circuit that includes a BIST circuit and a test control circuit. The BIST circuit further includes a BIST engine and fail logic for testing an imbedded memory array. The test control circuit includes three binary up/down counters, a variable delay, and a comparator circuit. A method of performing high speed memory diagnostics via BIST includes, but is not limited to, presetting the counters of the test control circuit, presetting the variable delay to a value that is equal to the latency of the fail logic, setting the BIST cycle counter to decrement mode, presetting the variable delay to zero, re-executing the test algorithm and performing a second test operation of capturing the fail data, and performing a third test operation of transmitting the fail data to the tester.

Abstract: A system for testing a DRAM includes DRAM blocks, the system further includes a processor based built-in self test system for generating a test data pattern, for each DRAM block, performing a write of the test data pattern into the DRAM block, performing a pause for a predetermined period of time, and performing a read of a resulting data pattern from the DRAM block. For each DRAM block, the performing the write of the test pattern into the DRAM block is performed before the performing the pause for the predetermined period of time, and the performing the read of the resulting data pattern from the DRAM block is performed after the performing the pause for the predetermined period of time, and at least a portion of the pause for the predetermined period of time of two or more the DRAM blocks overlap in time.