Abstract: Components such as lids (9) and electronic chip carriers (10) are assembled by registering respective mating faces of each component. An array of assembly stations (75) are formed on an upwardly extending edge (67) of a base (66) having a special inclination. For example, a lid (9) is supported with its mating face upturned and a carrier (10) is supported with its mating face downturned upon the upturned face of the lid (9) on the base (66). The inclination causes the components to slide relative to each other and the base in a given direction within each station (75). A plate (92) overlies a plate (72), supported on and inclined with the base (66). Plate (72) has an opening (74) and plate (92) has an overlying opening (94) to each station (75). The openings (74) and (94) have respective reference edges for stopping sliding of, and thereby positioning an upturned lid (9) and a downturned carrier ( 10) thereupon with a desired registration.

Abstract: An article such as a semiconductor wafer (10) is cut by splitting along a line (22) in a plane known to facilitate splitting. Wafer (10) is supported in a laterally unrestrained manner in a holder (34) lined with preferred paper (26) and fitted with a reference plate (43). Paper liner (26) is of a type having a surface (25) capable of developing lateral restraint by friction between such surface (25) and a surface (13) of wafer (10). A resilient force is applied normal to and upon a top surface (11) of wafer (10) by a press (60) having members (75 and 76) applied along line (22). Separation stresses develop along line (22) of the splitting plane and friction forces develop along paper surface (25) providing lateral resistance to an expected cutting force. A cutter (80) has an elongate tool (92) which is advanced at a top edge (27) of wafer (10) where it abuts plate (43).

Abstract: Articles such as miniature laser chips (15) are individually removed from an array on an adhesive web (20). A subjacent forming die has a planar, central surface (160) containing a vacuum cavity (120) and peripheral sloping surfaces (162). The web (20) has an adhesive side for holding the chips (15) and a smooth side for conforming to surfaces (160) and (162) of die (116). A leading target chip (15) is located centrally of cavity (120) on a planar portion of web (20) which portion is substantially restrained from movement away from die (116) by vacuum drawn in cavity (120). At the smooth side of web (20), within cavity (120), there is a needle (135) which is movable perpendicularly of and through web (20) along a path containing the target chip (15). At the adhesive side of web (20), opposite needle (135), there is a pickup probe (147) having a vacuum port (166 ) to retain a chip (15). Also, probe (147) is movable relative to and with a target chip (15) and the needle (135).

Abstract: Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

Abstract: Magnetic articles (10) are advanced in single file within a tube (14) for dispensing therefrom. A first magnetic device (20) establishes a magnetic field to releasably seize the leading article (10) such that trailing articles (10) are stopped in the tube (14). A second magnetic device (22) operates at a fixed location along the tube (14) and establishes a magnetic field to releasably seize the next trailing article (10) in the tube (14). A mechanism (40) then indexes the device (20) with the seized, leading article (10) a sufficient distance away from attraction of the second device (20) such that, when the leading article (10) is released by device (20), it is also released from tube (14).

Abstract: An off-line system for handling elongated magnetic articles such as axially leaded diodes 12 includes a magnetic receiving chute 20, a blocking mechanism 45, a magnetic loading station 75 for supporting at least one tray 55 and for loading diodes 12 therein, and a drive train 115. The chute 20 receives the diodes 12 and guides such diodes downwardly to an outlet 24 and the tray 55. Over a major accessible face of the tray 55 a cover 63 is slidably removable from a second end 60. At the loading station 75, the tray 55 is disposed in an upright manner resting on the second end 60 at a first elevation with a first end 59 extending at least to the outlet 24 of chute 20. An elevating mechanism 80 applied to the end 60 elevates tray 55 to a second elevation, while the cover 63 remains at about the first elevation. A portion of tray 55 is thereby opened adjacent the first end 59 which opening abuts to and registers with the outlet 24 of chute 20.

Abstract: Elongated magnetic diodes 12 are removed from a carrier 20 having a periphery along which the diodes 12 are advanced. A magnetic bin 75 has spaced sidewalls 76 and 77 extending to either side of the periphery of carrier 20. There is established between and transverse to the sidewalls a first magnetic field of sufficient strength to remove the diodes 12 from along a first distance at a first location on carrier 20. There is provided a movable retention mechanism 70 for optionally magnetically retaining the diodes 12 on carrier 20 as such diodes 12 are advanced along and beyond the first location and over a second distance to a second location. Mechanism 70 has a magnetic member 93 fixedly disposed along the second distance and a movable magnetic member 95 of sufficient length to retain the diodes 12 along the first distance. Member 95 is pivotally mounted to member 93 and member 95 is disposed in a normally inactive position within carrier 20.

Abstract: An axially leaded diode (12), travelling at a high rate of speed in a longitudinal direction, is terminated within a bin assembly (18). The bin (18) has first and second ends (43 and 44) and first and second sidewalls (21 and 22) including magnets (33-41) therein to orient a diode (12) transversely to such sidewalls. A tube (48) guides the diode (12) on a path forming a given angle "A" with the sidewalls (21 and 22). A discharge end (49) of tube (48) is located at the first sidewall (21) such that the diode (12) is discharged toward the second sidewall (22). A deceleration apparatus (54) is provided at discharge end (49) of tube (48) and spaced therefrom. Apparatus (54) includes a vertical bar (65) with a row of deceleration elements (66) extending therefrom toward the first end (43) of the bin (18). The row of elements (66) provides a penetrable restraint (64) such that a first lead (14) of a diode (12) discharged from tube (48) penetrates between the elements (66).

Abstract: Elongated magnetic articles 12 are introduced into vacant positions 31 on a carrier wheel 18 for a given operation. A magnetic bin 40 has a feed end in communication with wheel 18 and includes spaced sidewalls 41-44, with arm sections 43-44 thereof extending substantially beyond the periphery of wheel 18 and along the sides thereof. There is established between said sidewalls 41-44 a first, magnetic field and a second, stronger field to orient and suspend the articles 12 in bin 40. However, the field between arm sections 43-44 is established substantially within the periphery of wheel 18 and such field includes the stronger second field located in a specific region of arm sections 43-44.For loading articles 12 into continuously occurring vacant positions 31 which are advanced in an ascendent path, the stronger second field is located in a lower region of arm sections 43-44.

Abstract: Elongated magnetic articles 12 are transferred directly from a magnetic bin 17 and transported on a member 80 having deep slots 84 to retain the articles 12 for treatment. In a preferred example, the articles 12 include some articles 13 having undesirably shaped leads 14 and the treatment comprises lead straightening.A system of magnets 30 generates a magnetic field in the bin 17 which suspends and orients a supply of the articles 12 and 13 such that a dense, rotating pattern of articles is formed and urged against member 80. A pair of supports 57 and 58 limit the depth of the slots 84 at a first level to prevent more than one article 12 or 13 to enter therein. As an entered article 12 or 13 advances beyond the supply of articles, the supports 57 and 58 are discontinued and the entered article moves to a second level.

Abstract: Elongated articles (13), having an undesirable shape caused by a bent lead (14), are distinguished from elongated articles (12) which are desirably straight. The bent articles (13) are separated from a mass of articles (12 and 13), most of which are substantially straight. The articles (12 and 13) are typically axially leaded diodes having leads (14) which are magnetic. Such diodes (12 and 13) are successively introduced between sidewalls (11 and 22) of a bin (17) having a magnetic field which orients each article transverse to guide members (28 and 29) extending lengthwise of the bin (17). Each oriented diode (12 and 13) presents a distinctive configuration according to its shape when viewed against a plane transverse to the guide members (28 and 29). The major portion of a bent diode (13) will be disposed lower than the major portion of a straight diode (12).