Patents by Inventor Donald M. Odiwo

Donald M. Odiwo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for printing marks on the edges of wafers
    Patent number: 6908830
    Abstract: A method of repeatedly exposing a pattern across a wafer in a sequential stepping process is disclosed. The pattern that is exposed includes at least one alignment mark. Each time the exposing process is repeated, the current exposure overlaps a portion of the wafer where the pattern was previously exposed and thereby erases a previously exposed alignment mark by re-exposing an area of the wafer where the previously exposed alignment mark was located. After the exposing process is repeated across the wafer, alignment marks remain only in the last exposed areas of the wafer.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: June 21, 2005
    Assignee: International Business Machines Corporation
    Inventors: Andrew Lu, Donald M. Odiwo, Roger J. Yerdon
  • A METHOD FOR PRINTING MARKS ON THE EDGES OF WAFERS
    Publication number: 20040259322
    Abstract: A method of repeatedly exposing a pattern across a wafer in a sequential stepping process is disclosed. The pattern that is exposed includes at least one alignment mark. Each time the exposing process is repeated, the current exposure overlaps a portion of the wafer where the pattern was previously exposed and thereby erases a previously exposed alignment mark by re-exposing an area of the wafer where the previously exposed alignment mark was located. After the exposing process is repeated across the wafer, alignment marks remain only in the last exposed areas of the wafer.
    Type: Application
    Filed: June 23, 2003
    Publication date: December 23, 2004
    Applicant: International Business Machines Corporation
    Inventors: Andrew Lu, Donald M. Odiwo, Roger J. Yerdon