Abstract: An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

Abstract: An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

Abstract: A shaped article having EMI shielding properties, having been shaped by thermoforming of a planar sheet, and having a shape requiring the planar sheet to exhibit a stretch ratio of at least about 300%, and up to about 500%. The article consists essentially of a fibrous metal mat substantially surrounded by a fiber-coat and a polymeric carrier for support of the mat. The fiber mat may also be embedded into the carrier material. The fiber-coat may be sprayed onto the mat or, as a thermoplastic material, may be forced together with the metal fiber mat to surround it, and such procedure may take place before or after attachment to the carrier material.

Abstract: A thermoformable add-on EMI shielding sheet comprising a carrier material selected from polymeric films and fibrous webs having the capability of becoming porous when thermoformed, having a metal mat at least partially embedded therein, comprising a plurality of fine, randomly-oriented metal fibers, the carrier material having a softening temperature lower than the highest temperature reached during the thermoforming process.

Abstract: A conformable electromagnetic radiation suppression cover comprising one or more absorbing material(s) and a sealant. The cover conforms to the shape of a reflecting structure due to forces internal to the absorbing material(s) when the cover is subjected to an agent external to the cover. The absorber comprises dissipative particles bound in a conformable polymeric binder. The sealant is positioned to seal the conformable cover to the reflecting structure, and provides environmental protection to the structure and preferably better adhesion between the cover and the structure. In a preferred embodiment, the volume of the cover is varied before shrinkage to produce a cover thickness in the direction of incident radiation, as measured after shrinkage, which produces a preselected resonant frequency for the cover. The cover may include a conductive surface, such as a metallic foil. Impedance matching materials are preferred but not required.

Abstract: A flexible sheet material for forming an envelope used to enclose and protect electronic components from electrostatic charges during storage and shipment. The sheet material is sufficiently transparent to afford visual identification of an electronic component through the envelope, while including a polymeric sheet having a high volume resistivity to electrically isolate a component within the envelope, an antistatic material which is disposed at an inner surface of the envelope for dissipating and restricting electrostatic charges on components within the envelope, and a highly conductive layer which is then disposed on the outer surface of the polymeric sheet and provides a highly conductive outer surface on the envelope for grounding electrostatic charges brought into contact with the envelope.

Abstract: A flexible material for forming an envelope used to enclose and protect electronic components from electrostatic charges during storage and shipment. The material is sufficiently transparent to afford visual identification of an electronic component through the envelope, while including a sheet of polymeric material having a high volume resistivity to electrically isolate a component within the envelope, an antistatic material which is disposed at an inner surface of the envelope for dissipating and restricting electrostatic charges on components within the envelope, and a highly conductive layer which is then disposed on the outer surface of the polymeric sheet and provides a highly conductive outer surface on the envelope for grounding electrostatic charges brought into contact with the envelope.