Abstract: A large array probe/contact having spring characteristics for relieving stress in the contact caused, for example, by temperature change is fabricated using a unique combination of semiconductor fabrication operations. The contacts in the array have a “U” shaped resilient portion, are fixed at one end to a substrate and have an accessible low electrical noise contact tip. The contacts are encapsulated on the substrate in an elastomer to provide additional stress relief resilience, support and protection from damage during handling.

Abstract: A liquid crystal display assembly contains a liquid crystal in a chamber formed between two plates and enclosed by a surrounding seal. Polarizer layers are attached to one or both plates, wherein the polarizer layers extend to the edges of the one or both plates. A uniform thickness adhesive layer is applied to the polarizer layers and additional layers are fixed by the adhesive to the assembly as required by the end purpose of the display. Curing of the uniform thickness adhesive layer results in uniform stress throughout the adhesive layer with resulting reduction of display assembly distortion.