Patents by Inventor Donald Malcolm MacIntyre

Donald Malcolm MacIntyre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer scale semiconductor structure
    Patent number: 7215025
    Abstract: A chip scale package structure formed by adhering a glass sheet having a pattern of holes matching a pattern of bond pads on a semiconductor wafer so that the pattern of holes on the glass sheet are over the pattern of bond pads on the semiconductor wafer. Metallized pads are formed on the glass sheet adjacent to each hole and in one embodiment a conductive trace is formed from each metallized pad on the glass sheet to the bond pad on the semiconductor wafer under the adjacent hole. In a second embodiment, a pad is formed on the glass sheet adjacent to each hole and the pad extends down the sides of the adjacent hole. The hole is filled with a metal plug that electrically connects the pad on the glass sheet to the bond pad on the semiconductor wafer. In each embodiment a solder ball is formed on each pad on the glass sheet.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: May 8, 2007
    Assignee: MCSP, LLC
    Inventor: Donald Malcolm MacIntyre
  • Wafer scale method of packaging integrated circuit die
    Patent number: 6753208
    Abstract: A chip scale package structure formed by adhering a glass sheet having a pattern of holes matching a pattern of bond pads on a semiconductor wafer so that the pattern of holes on the glass sheet are over the pattern of bond pads on the semiconductor wafer. Metallized pads are formed on the glass sheet adjacent to each hole and in one embodiment a conductive trace is formed from each metallized pad on the glass sheet to the bond pad on the semiconductor wafer under the adjacent hole. In a second embodiment, a pad is formed on the glass sheet adjacent to each hole and the pad extends down the sides of the adjacent hole. The hole is filled with a metal plug that electrically connects the pad on the glass sheet to the bond pad on the semiconductor wafer. In each embodiment, a solder ball is formed on each pad on the glass sheet.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: June 22, 2004
    Assignee: MCSP, LLC
    Inventor: Donald Malcolm MacIntyre
  • Chip scale packages
    Patent number: 6555469
    Abstract: A chip scale package structure formed by adhering a glass sheet having a pattern of holes matching a pattern of bond pads on a semiconductor wafer so that the pattern of holes on the glass sheet are over the pattern of bond pads on the semiconductor wafer. Metallized pads are formed on the glass sheet adjacent to each hole and in one embodiment a conductive trace is formed from each metallized pad on the glass sheet to the bond pad on the semiconductor wafer under the adjacent hole. In a second embodiment, a pad is formed on the glass sheet adjacent to each hole and the pad extends down the sides of the adjacent hole. The hole is filled with a metal plug that electrically connects the pad on the glass sheet to the bond pad on the semiconductor wafer. In each embodiment, a solder ball is formed on each pad on the glass sheet.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: April 29, 2003
    Assignee: Microcsp, Inc.
    Inventor: Donald Malcolm MacIntyre