Patents by Inventor Donald Michael

Donald Michael has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for hermetic sealing of post media-filled MEMS package
    Patent number: 7534662
    Abstract: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: May 19, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Charles C. Haluzak, Donald Michael
  • Printhead Evacuation Mechanism And Method
    Publication number: 20080043075
    Abstract: A valve mechanism and a method for preparing an inkjet print cartridge and printer for inactivity is herein disclosed. Pressurized fluid is introduced to a standpipe volume to create a pressure differential that forces ink within the standpipe into an ink reservoir.
    Type: Application
    Filed: October 29, 2007
    Publication date: February 21, 2008
    Inventors: Jeffrey Langford, Ross Friesen, Carrie Harris, Harold Mantooth, Donald Michael
  • Package having bond-sealed underbump
    Publication number: 20060292748
    Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 28, 2006
    Inventors: Charles Haluzak, Martha Truninger, Donald Michael
  • Ink recirculation system
    Publication number: 20060187278
    Abstract: One embodiment of a method of storing a printhead includes opening a valve to a vent of an ink reservoir, operating a pump in a first direction to pull ink from the ink reservoir through said valve, and pumping the ink pulled from the ink reservoir to an ink supply container.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 24, 2006
    Inventors: Jeffrey Langford, Donald Michael, Kris English, Carrie Harris
  • Printhead evacuation mechanism and method
    Publication number: 20060164470
    Abstract: A valve mechanism and a method for preparing an inkjet print cartridge and printer for inactivity is herein disclosed. Pressurized fluid is introduced to a standpipe volume to create a pressure differential that forces ink within the standpipe into an ink reservoir.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 27, 2006
    Inventors: Jeffrey Langford, Ross Friesen, Carrie Harris, Harold Mantooth, Donald Michael
  • Method and apparatus for reducing nozzle failure in stored inkjet printheads
    Publication number: 20060023036
    Abstract: An inkjet printhead and a method for increasing the shelf life thereof are herein disclosed. The inkjet printhead has one or more nozzles for dispensing a colorant. These nozzles are fluidically connected to a reservoir. A first colorant substantially fills the nozzles while a second colorant is reserved in the reservoir.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 2, 2006
    Inventors: Jeffrey Langford, Donald Michael, Harold Mantooth
  • Package having bond-sealed underbump
    Publication number: 20050275072
    Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
    Type: Application
    Filed: May 26, 2004
    Publication date: December 15, 2005
    Inventors: Charles Haluzak, Martha Truninger, Donald Michael
  • Removing gas from a printhead
    Publication number: 20050275679
    Abstract: A method of removing gas from a printhead that includes a plurality of orifices configured to receive ink from a supply conduit through passages extending from the supply conduit to the plurality of orifices. The plurality of orifices are sealed from external the printhead to restrict passage of fluid through the orifices. Ink is moved along the supply conduit and through an outlet of the supply conduit disposed downstream of the passages, with the plurality of orifices sealed, so that ink displaces gas from the supply conduit.
    Type: Application
    Filed: June 30, 2005
    Publication date: December 15, 2005
    Inventors: Ashley Childs, Daniel Stirn, Harold Mantooth, Kit Harper, Donald Michael, Ian Anderson
  • System and methods for hermetic sealing of post media-filled MEMS package
    Patent number: 6946728
    Abstract: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: September 20, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Charles C. Haluzak, Donald Michael
  • System and methods for hermetic sealing of post media-filled MEMS package
    Publication number: 20050202591
    Abstract: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
    Type: Application
    Filed: May 11, 2005
    Publication date: September 15, 2005
    Inventors: Chien-Hua Chen, Charles Haluzak, Donald Michael
  • SYSTEM AND METHODS FOR HERMETIC SEALING OF POST MEDIA-FILLED MEMS PACKAGE
    Publication number: 20050184382
    Abstract: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 25, 2005
    Inventors: Chien-Hua Chen, Charles Haluzak, Donald Michael
  • Removing gas from a printhead
    Publication number: 20050168520
    Abstract: A method of removing gas from a printhead is provided. A sealing material may be applied to orifices of a printhead from external the printhead to restrict passage of fluid through the orifices. Ink may be moved through a printhead conduit disposed in fluid communication with the orifices to create an inward suction adjacent the orifices so that the gas is displaced from adjacent the orifices.
    Type: Application
    Filed: January 30, 2004
    Publication date: August 4, 2005
    Inventors: Hal Mantooth, Kit Harper, Donald Michael, Ian Anderson