Abstract: A conductive sleeve includes a central portion with a front, a rear, and sides; at least one flange mated with at the sides of the central portion; and capacitive section that extends from a portion of the central portion at the rear of the central portion. The central portion is adapted to be placed over an end of a cable and extend over at least one conductor of the cable. The at least one flange is adapted to connect with a mating conductor. The capacitive section has a width smaller than a width of the central portion and is adapted to be placed immediately adjacent to an insulator of the cable and another conductor of the cable to form substantially a capacitive shorting circuit.

Abstract: A conductive sleeve includes a central portion with a front, a rear, and sides; at least one flange mated with at the sides of the central portion; and capacitive section that extends from a portion of the central portion at the rear of the central portion. The central portion is adapted to be placed over an end of a cable and extend over at least one conductor of the cable. The at least one flange is adapted to connect with a mating conductor. The capacitive section has a width smaller than a width of the central portion and is adapted to be placed immediately adjacent to an insulator of the cable and another conductor of the cable to form substantially a capacitive shorting circuit.

Abstract: A socket for removably mounting a bare die to a substrate, such as a printed circuit board. This socket is formed by insert molding signal conductors in an insulative housing. A ground structure is separately provided to control the impedance of the signal conductors and to reduce cross talk. The ground structure may be formed as a separate subassembly and attached to the subassembly formed by insert molding a housing around signal conductors. The ground structure also provides ground connections between the printed circuit board and the chip.

Abstract: A chip socket with one or more seals protecting the contact members. The seals are formed in a multi-step molding process. In a first step, an insulative housing is formed with grooves in the surface. In the second step, a seal material is molded into the grooves with a portion extending above the surface of the insulative housing. In use, surfaces of the chip socket are pressed against a semiconductor chip or a circuit board. When pressed together, the components of the connector system form seals that protect contact members from environmental conditions. The seals allow reliable electrical connections to be made with reduced force per contact. Greater flexibility in designing the contact members is therefore provided contact members having a low spring force and a relatively large deflection range, thereby accommodating a less stringent coplanarity requirement for the chip and circuit board.

Abstract: There is disclosed a two-piece electrical connector assembly having a first electrical connector and a second electrical connector. The first electrical connector includes a plurality of first signal conductors disposed along first and second sides of a first insulative housing and first ground plates disposed along the first and second sides of the first insulative housing and positioned adjacent the plurality of first signal conductors. The first electrical connector defines a slot for receiving an edge of a first printed circuit board. The second electrical connector includes a plurality of second signal conductors disposed along first and second sides of a second insulative housing and second ground plates disposed along the first and second sides of the second insulative housing and positioned adjacent the plurality of second signal conductors.