Abstract: A substantially transparent housing (202) for an electronic device (100) is capable of enclosing at least one component (502, 504). The enclosed at least one component (502, 504) can be visible from the outside of the housing (202). The housing (202) includes an outer surface (701) and an inner surface (702). A portion of the inner surface (703) is textured to provide a translucent surface. A portion of the outer surface (704) overlaps the textured portion of the inner surface (703). The overlapping portion of the outer surface (704) has opaque marks (602). The opaque marks (602) provide information visible from the outside of the housing (202). A method is also provided for applying the opaque marks (602) to the housing (202).

Abstract: A method for controlling the mass of solder applied to a printed circuit substrate (202) by a solder printer (200), whereby the mass of solder paste (114) applied to a printed circuit substrate (202) is controlled by measuring the mass of the solder paste (114) that was applied to a first printed circuit substrate. The mass data measured is then compared to a predetermined mass to produce a control signal. The mass of the solder applied to a second printed circuit substrate is controlled as a function of the control signal so that the mass of the solder applied to the second substrate more closely approaches the predetermined mass.