Abstract: A waveguide assembly for a process sealed level gage includes first and second waveguide portions, a process sealing cavity and a mechanical barrier. The first waveguide portion has a first waveguide bore. The second waveguide portion is fastened to the first waveguide portion and has a second waveguide bore which is axially aligned with the first waveguide bore for communicating microwave signals at a waveguide wavelength .lambda..sub.G between the waveguide bores. The process sealing cavity is formed at an interface between the first and second waveguide portions. The mechanical barrier includes a first shaft section positioned within the first waveguide portion, a second shaft section positioned within the second waveguide portion and a raised annular shoulder positioned at the interface, within the process sealing cavity. The raised annular shoulder has a width, which is measured radially outward from an outside diameter of the shaft sections, of approximately 1/2 .lambda..sub.