Abstract: A bicycle crank has flexible crank arms designed to deflect elastically under the influence of force on the pedals, allowing the point of application of force to advance relative to the rotational position of the sprocket device. In a preferred embodiment the crank arms are made of glass fiber-reinforced epoxy, and have a generally rectangular cross section.

Abstract: A system for moving and processing workpieces includes individual stations isolated from one another and from a main chamber by seals formed by a transport mechanism. Workpieces are moved in a queue in a circular pattern, by a dial turret operated by a bell-crank and a Geneva mechanism. Stations seal to the baseplate from below, and a vacuum chamber encloses the turret assembly which operates on a post through a center hole in the baseplate. Workpieces loaded to one depended chamber are withdrawn from chambers and inserted into next chambers in a circular pattern, passing through the main chamber with each transfer, and ending back in the chamber where they were loaded. In an alternative embodiment passages between the main chamber and each individual chamber have valves allowing processing to take place without carriers attached to the turret being in the processing chambers.

Abstract: A sputter coating source has separate annular targets spaced outwardly from each other around a central axis. Magnetic field generating means are provided to establish magnetic field lines over each target around an annular path. Each target has its own separate magnetic field generating means including an electromagnet having a separately controllable power supply whereby the strength of the magnetic field over each target may be separately controlled. The targets are electrically separated from each other, and each target has a separately controllable power supply whereby the plasma power for each target may be separately controlled. More than two separate targets may be employed, and the various targets may be positioned at different distances from the substrate. The targets may be made of magnetic material.

Abstract: A composite sputtering target is provided which is constructed of a non-magnetic sputtering material bonded to a magnetic backing material. A magnetic field is provided through the backing material by a magnetic system, so that the backing material and magnetic system form a closed flux path. During sputtering the magnetic system is operated at a high enough field strength to saturate the backing plate. This saturation causes a fringing field over the non-magnetic target similar to that obtained with magnetic target systems. In another embodiment, the return path for magnetic flux beneath the target material is a permanent part of the magnetic system instead of being permanently attached to the target material as a backing for support.

Abstract: A novel magnetron sputter coating source is disclosed in which magnetic sputter targets containing relatively large inventories of usable material may be employed. This coating source may also be used efficiently and effectively with sputter target materials having properties which range from nonmagnetic to highly ferromagnetic. Use of an electromagnetic coil with a widely adjustable energizing current, rather than permanent magnets, allows a wide range of magnetic properties to be accommodated. Electrical impedance of the glow discharge is readily controlled using the current flow through the electromagnetic coil, allowing, for example, operation at desired values of voltage and current throughout the life of the sputter target. In addition, a momentary increase in electromagnet coil current can be used to achieve ignition of the glow discharge at a desired sputter gas operating pressure which is below the sputter gas pressure at which the glow discharge can normally be readily ignited.

Abstract: The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.

Abstract: A system for handling and individually processing a plurality of thin substrates is described. The system includes a main chamber, entrance and exit load locks, a plurality of processing stations, a load lock load/unload means, a vertical transport means, and a horizontal transport means. In one embodiment the processing stations are deployed in a U-shaped configuration, allowing the entrance and exit load locks to be positioned at the same end of the machine. Idle stations between processing stations may also be employed. The substrates are vertically oriented and are raised and lowered into and out of load locks and processing stations by means of dedicated lift blades. Substrates are transferred within the main chamber from lift blades of one station to lift blades of an adjacent station by means of substrate carriers affixed to a walking beam mechanism.