Abstract: A power probe for in-situ electron microscope viewing of electromigration in aluminum thin films has a probe holder, a detachable probe tip and, mounted on the probe tip, a quartz power distributor. A test specimen, such as an integrated circuit component, can be viewed inside the electron microscope while logic gates or other components are exercised. The probe holder is shaped to mate to a conventional electron microscope side entry port. The probe tip attaches to the end of the probe holder and extends into the electron beam path. The test specimen mounts on the power distributor which is in turn mounted inside a trough at the end of the detachable probe tip. The probe tip and power distributor include mutually aligned openings, over which the test specimen mounts, for the electron beam path.

Abstract: This invention relates to an alloy for bonding gold-plated substrates together. In a more specific aspect, it relates to a braze alloy for bonding gold-plated lids to gold-plated seal rings or gold-plated Kovar substrates. In another aspect, it deals with a method for bonding gold-plated lids to gold-plated Kovar substrates.

Abstract: An alloy for brazing a silicon die to a gold-plate kovar header consists essentially of 19 to 21 weight percent tin and 0.6 to 0.8 weight percent silicon with the balance being gold. The alloy melts at a temperature below 200.degree. C. which is substantially lower than that of the conventional gold-silicon eutectic alloy.