Patents by Inventor Donald R. Storjohann

Donald R. Storjohann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020090484
    Abstract: Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald R. Storjohann