Abstract: A method and apparatus are provided for cleaning rosin flux residues off of printed wiring assemblies. In accordance with the invention printed wiring assemblies are placed within a processing chamber and a vacuum pump is used to draw a vacuum within the processing chamber. The rosin flux residues are then washed off of the printed wiring assemblies using a solvent for dissolving and removing the flux residues.

Abstract: A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has a thermal expansion controller Copper-Invar-Copper core therein with portions of the invar core therein with portions of the Invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the Copper-Invar-Copper core thereby selectively etching portions of the copper and Invar up to the noble metal layer and thereby providing for selectively removing the Invar and replacing it with a laminant material.

Abstract: A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has thermal expansion controlling copper invar copper core therein with portions of the invar core therein with portions of the invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the copper invar copper core thereby selectively etching portions of the copper and invar up to the noble metal layer and thereby providing for selectively removing the invar and replacing it with a laminant material.

Abstract: A method and apparatus for manufacture and repair of thermally durable surface mounted device printed wiring assemblies which includes a printed wiring assembly having surface mounted devices thereon, which are attached to said wiring assembly by a quenched or rapidly soldified soldier joint. A method for manufacture and repair of such printed wiring assemblies is to heat the TWAs with SMDs thereon, above the solder melting temperature, and then expose the solder to a fluid below the solder melting temperature which is capable of absorbing heat rapidly from the solder. The intermediate solder joint is thereby rapidly solidified to achieve the advantages of the investive method.