Abstract: An apparatus and method wherein a punching tool is used to punch a downspout hole in the bottom wall of a rain gutter, and wherein a swaging tool is insertable into a gutter drop after the gutter drop is inserted into the downspout hole to swage-lock the gutter drop to the rain gutter.

Abstract: A method of manufacturing a semiconductor device having a multi-layer wiring system includes the steps of providing a first pattern of conductive regions on a major surface, providing an intermediate conductive layer over the major surface and the first pattern conductive regions, providing a second pattern of conductive tracks on the intermediate layer, and selectively etching the intermediate layer using the second pattern of tracks as an etching mask to completely remove the intermediate layer by underetching below portions of the second pattern tracks crossing over portions of the first pattern of conductive region where no electrical interconnection between the first and second conductive patterns is desired, while only partially removing the intermediate layer by underetching below portions of the second pattern of tracks crossing over portion of the first pattern of semiconductor regions where an electrical interconnection between the first and second conductor patterns is desired.