Abstract: The present invention relates to a process for production, shipment, and treatment of a NH4F(HF)x feedstock for local production of fluorine and NF3 for semiconductor chamber cleaning without the need for storage of large quantities of dangerous feeds and intermediate products.

Abstract: A method of heating a surface susceptible to oxidation or reduction includes generating a central, generally cylindrical, fuel-rich particulate jet, and a coaxial, annular, supersonic velocity, oxidant-rich jet having a temperature greater than the auto-thermal ignition temperature of the fuel-rich particulate jet, directed toward the surface to be heated, the velocity of the fuel-rich particulate jet being less than the velocity of the oxidant-rich jet; allowing the supersonic oxidant-rich jet and the fuel-rich particulate jet to coact to form a coherent particulate fuel-rich and fuel-lean jet having a central particulate fuel-rich region and a coaxial annular fuel-lean region; impinging the coherent particulate fuel-rich and fuel-lean jet upon the surface to be heated for forming a turbulent reaction zone at the surface; and controlling oxidation and reduction reactions at the turbulent reaction zone by adjusting properties of the supersonic oxidant-rich jet and/or the fuel-rich particulate jet.

Abstract: The present invention relates to a process for production, shipment, and treatment of a NH4F(HF)x feedstock for local production of fluorine and NF3 for semiconductor chamber cleaning without the need for storage of large quantities of dangerous feeds and intermediate products.

Abstract: Apparatus and methods useful for disposal of hydrogen generated from a fluorine generation cell are described. In one embodiment the apparatus comprises an aerosol reduction unit and a catalytic combustion unit. The catalyst in the catalytic combustion unit is maintained at a temperature such that a pilot light or electrical spark apparatus may be eliminated. Fluorine generation apparatus and methods including an aerosol reduction unit and catalytic unit are also described.

Abstract: A method for selecting, using, regenerating, and recycling fluorochemicals for plasma cleaning and etching steps for semiconductor device production is provided. This method comprises selection of a regenerable fluorochemical, using the regenerable fluorochemical working fluid for chamber cleaning or etching, and regenerating the fluorochemical working fluid with sequential fluorination and defluorination steps. This invention allows the efficient use of the most cost-effective and safe chamber cleaning gases without adversely affecting the environment.