Abstract: An electrostatic discharge contact (70) comprises a proximal portion (72), a distal portion (74), and substantially flat outside (76) and inside surfaces (78) extending therebetween. Retention dimples (80) are disposed in spaced-apart relation on the proximal portion (72) of the outside surface (76). The retention dimples (80) are adapted to engage a corresponding cavity (100) in an insulative connector housing (15). An arm (82) extends away from proximal portion (72) of the electrostatic discharge contact (70). The arm (82) includes a rounded distal end (86) that is adapted to electrically engage a portion of a board mount (130) that is already assembled to the electrical connector (10).

Abstract: An electrical connector assembly (1) comprises, a first electrical connector (2), electrical contacts (7) in the first electrical connector extending to a mating face (6) of the connector (2), alignment posts (12) and first ground contacts (10) along the alignment posts (12), both of which project beyond the mating face (6); and another, mating electrical connector (3) provided with post receiving cavities (11) with second ground contacts (10) in the cavities (11) engaging the first ground contacts (10) along the posts (12).

Abstract: An electrical connector assembly ( b 10) includes a connector (22) for interconnecting circuit boards such as a daughter board (12) to a mother board (102) wherein contact pads on the boards are on very small centers. Connector (22) includes a housing having an upper housing portion (24) and a pair of lower housing subassemblies (60), each subassembly including housing (62) having first and second contact members (74, 92) affixed thereto with the contact members having upper ends (78, 92) made to lie on a common plane and engage one side of a circuit board (12) inserted into the connector (22) in a resilient engagement therewith, anfd having lower ends which form solder tails (88, 96) held for soldering to pads (106, 108) on a mother board with such contact membrs being formed with the solder tails (88, 96) interdigitated to lie in a common row and a common plane on center spacings substantially less than center spacings of the upper ends.