Abstract: A connection assembly for two or more optical fibers, which is hermetically sealed by means of a thin-walled flexible metallic sleeve. The assembly comprises two fiber ends, each terminating in an optical component such as a lens, the lenses having distal end faces held together so that light can pass from one fiber to the other through the lenses, and a fiber tube is mounted on each fiber adjacent the proximal ends of the respective lens and is hermetically sealed to the fiber. Each fiber tube has a metallic coating, and the thin-walled metallic sleeve is connected by solder to the metallic coatings on the fiber tubes. Preferably, the metallic sleeve has a central portion with bellows-like convolutions.

Abstract: A method for preparing optical fibers for an evanescent field coupler by forming a groove along a top surface of a substrate block, wherein the groove is formed shallower than the diameter of a stripped fiber. An optical fiber is positioned in the groove, wherein a center portion of the optical fiber is stripped of its coating. The optical fiber is glued in the groove, then polished to remove a portion of its cladding to form a coupling region, while not polishing the top surface of the substrate block. An optical signal is applied to an end of the optical fiber while loss of the optical signal is measured at the coupling region. Polishing and monitoring are repeated until a desired loss value is reached. The coupler can be added to an operating optical communication system.

Abstract: An integrated semiconductor device is formed by bonding the conductors of one fabricated semiconductor device having a substrate to the conductors on another fabricated semiconductor device having a substrate, flowing an etch-resist in the form of an uncured cement (e.g. epoxy) between the devices, allowing the etch-resist to solidify, and removing the substrate from one of the semiconductor devices. Preferably the etch-resist epoxy is retained to impart mechanical strength to the device. More specifically, a hybrid semiconductor device is formed by bonding the conductors of one or more GaAs/AlGaAs multiple quantum well modulators to conductors on an IC chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.

Abstract: Described is a plastic encapsulated electronic device having an integrated circuit unit, a lead frame and a plastic material encapsulating the IC unit and portions of the leads into a sealed package. Each of the leads includes an inner portion adjacent the IC unit, an outer portion laying in a different plane than the inner portion, and a central portion interconnecting the inner and the outer portions. The plastic enclosure is so formed that the outer portion of each lead, except for its lowermost flat surface and a short outermost section, is embedded in the plastic material. The bottom surface of the plastic enclosure is substantially coplanar with the lowermost flat surface of each lead. The short outermost portion of the outer lead portion extends beyond the plastic material for testing purposes. This arrangement provides for a robust encapsulation of the leads avoiding the prior problems of the prior art.

Abstract: A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB.

Abstract: Magnetic circuit elements, e.g. for inclusion on circuit boards including one or more windings about a toroidal core are produced by joinder of mating sheets, one or both recessed to hold the core, and each containing partial windings. Joinder is by use of an anisotropically conducting adhesive layer. The layer is applied as an uncured thermosetting adhesive containing spherical conducting particles of such size and distribution as to statistically result in electrical completion of windings while avoiding turn-to-turn shorting.