Patents by Inventor Donald W. DiAngelo
Donald W. DiAngelo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8156990Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: April 17, 2012Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 7947143Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: May 24, 2011Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 7836935Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: November 23, 2010Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20080190565Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20080190545Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20080190566Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 6351871Abstract: This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.Type: GrantFiled: June 17, 1999Date of Patent: March 5, 2002Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, John T. Butler, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, James N. Humenik, John U. Knickerbocker, Daniel S. Mackin, Glenn A. Pomerantz, David E. Speed, Candace A. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 6280527Abstract: This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.Type: GrantFiled: June 12, 1998Date of Patent: August 28, 2001Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, John T. Butler, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, James N. Humenik, John U. Knickerbocker, Daniel S. Mackin, Glenn A. Pomerantz, David E. Speed, Candace A. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 6032683Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.Type: GrantFiled: February 26, 1999Date of Patent: March 7, 2000Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker, David C. Long, Daniel S. Mackin, Glenn A. Pomerantz, Krishna G. Sachdev, David E. Speed, Candace A. Sullivan, Robert J. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 5916374Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.Type: GrantFiled: February 9, 1998Date of Patent: June 29, 1999Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker, David C. Long, Daniel S. Mackin, Glenn A. Pomerantz, Krishna G. Sachdev, David E. Speed, Candace A. Sullivan, Robert J. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 5446246Abstract: A semiconductor ceramic packaging substrate has the usual vias of sintered electrically conductive metal extending through the substrate. There are the usual metal conductor lines comprising conductive elements on the surface of the substrate. Each via is connected to the conductive elements in a predetermined pattern through a conductive via cap on the surface of the ceramic package. The caps join each conductive element and each via. The cap has a width substantially larger than the diameter of the via at the point of contact of the via and the conductive element in contact with it. The caps are also substantially thicker and wider than the conductive elements.Type: GrantFiled: January 24, 1994Date of Patent: August 29, 1995Assignee: International Business Machines CorporationInventors: Kamalesh S. Desai, Donald W. DiAngelo
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Patent number: 5205035Abstract: In the fabrication of a circuit device including a substrate for providing connections between connection pins to be bonded to I/O pads on one side of the substrate and chips to be bonded to pads on the other side of the substrate, bonding is achieved simultaneously on both sides of the substrate by using a pin holder on an upper side of the substrate and using the surface tension of a flux to adhere and finely position the chips on the lower side of the substrate. The same or a modified technique may be used for the replacement of chips during repair of the circuit device. Repair of damaged or defective pin bonds yields a bond which is structurally and electrically improved in comparison with the originally formed bond.Type: GrantFiled: January 24, 1992Date of Patent: April 27, 1993Assignee: International Business Machines CorporationInventors: Donald W. DiAngelo, Clifford T. Rogers, James T. Taylor