Abstract: A system is provided and includes a system chassis through which an airflow is defined, including a set of receiving units, a set of 3.5? HDDs, each being disposed in a receiving unit of a portion of the set, and each having a profile that blocks a first quantity of the airflow, a set of 2.5? HDDs, each being disposed in a receiving unit of a remaining portion of the set, and each having a profile that blocks a second quantity of the airflow, and a set of airflow blockage devices, each being respectively disposed within each of the receiving units of the remaining portion of the set, to each have a cavity defined therein in which the corresponding 2.5? HDD is secured with a third quantity of the airflow traversing a surface thereof and a profile that blocks a fourth quantity of the airflow through the corresponding receiving unit.

Abstract: An electrical cabinet includes at least one modular enclosure connectable to at least one of a further, substantially identical modular enclosure, and a pedestal enclosure. The modular enclosure has a generally parallelepiped shape, with at least one space therein for the placement of components. A cover is positionable over the exterior sides of the enclosure, and includes a modular rear cover section positionable over the rear side of the modular enclosure to essentially hide the rear side of the modular enclosure from view.

Abstract: A circuit board mounted integrated circuit chip such as a processor is cooled by apparatus including a heat sink, a shroud and a fan. The heat sink includes a base placed on the top surface of the chip and fins extending up from the base. The shroud includes top and two opposed side walls closely enclosing the heat sink. The shroud is attached directly to the circuit board rather than to the heat sink or chip and can be used with chips and heat sinks that do not have special provision for attachment of the shroud. The fan moves cooling air through the shroud and between and around the heat sink fins. The fan is mounted to an end of the shroud and does not require clearance above the heat sink and shroud.