Patents by Inventor Donald W. Finley

Donald W. Finley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant bump technology
    Patent number: 5783465
    Abstract: The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: July 21, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Everett Joseph Canning, Donald W. Finley, Charles K. Hoppes, Michael Sheridan
  • Printed circuit board
    Patent number: 4221925
    Abstract: A printed circuit board is disclosed which comprises a metal substrate having a first coating thereon and through holes through said coating and substrate with non-linear, undercut walls and a dielectric film coating over said first coating and said non-linear, undercut walls of said through hole. Electrical circuitry is then formed on the dielectric coat in conjunction with the through hole.
    Type: Grant
    Filed: September 18, 1978
    Date of Patent: September 9, 1980
    Assignee: Western Electric Company, Incorporated
    Inventors: Donald W. Finley, Robert B. Lewis
  • Method of fabricating a printed circuit board with etched through holes
    Patent number: 4145460
    Abstract: A method of fabricating a printed circuit board is disclosed. The method comprises forming a patterned etch resist layer on a metal substrate and selectively etching the substrate to form a through hole with non-linear undercut walls. The etched metal substrate having the resist layer thereon is then coated with a dielectric powder to form a dielectric coat on the substrate having a sufficient through hole edge coverage.
    Type: Grant
    Filed: June 27, 1977
    Date of Patent: March 20, 1979
    Assignee: Western Electric Company, Inc.
    Inventors: Donald W. Finley, Robert B. Lewis