Abstract: Semiconductor wafers within a supporting vertical wafer tower are positioned within a vertical process chamber through a lower gate valve fixed to a supporting framework. The gate valve is sealed to a similar gate valve at the upper end of a movable load lock on the framework, within which the wafers are subjected to pre-treatment and post-treatment processes. Two load locks are alternately used in conjunction with the process chamber and a wafer loading station on the framework. In addition, a cleaning element is movably mounted on the framework for periodically maintaining the interior surfaces of the process tube within the process chamber.

Abstract: Vertically oriented thermal processor, also known as a vertical diffusion furnace for the processing of silicon or gallium arsenide wafers or substrates including a vertically positionable furnace assembly, and a quartz bell-jar shaped element which positions coaxially over and about another quartz bell jar like vertically positionable process tube forming a dual wall contamination barrier. The furnace and the process tube bell jar can be moved up and down pneumatically as a unit or independently of one another during processing modes. Pneumatic cylinders provide for the lifting of the furnace element away from the wafers to ramp temperatures downwardly at an accelerated rate. An overhead track positions for accelerated removal of the furnace and process tube to the exterior of the cabinet without disconnection of electrical, pneumatic or gas connections for maintenance or component changeout.