Patents by Inventor Donald W. Himler

Donald W. Himler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method with lead or tin sublayer
    Patent number: 4082621
    Abstract: A nickel or cobalt layer is electroplated from a fluoborate bath directly onto a lead or lead alloy or tin or tin alloy sublayer, which has been electroplated onto a metal surface. Microcracked chrome is electroplated over the nickel or cobalt layer. With a nonconductive plastic substrate, the sublayer is electroplated onto a metal film which was deposited on the plastic by an electroless method. The plated product includes a sublayer of about 0.05 to 2 mils lead or lead alloy or tin or tin alloy, a second layer of about 0.05 to 2 mils nickel or cobalt, and an outer layer of about 0.001 to 1 mil chrome.
    Type: Grant
    Filed: January 3, 1977
    Date of Patent: April 4, 1978
    Assignee: Allied Chemical Corporation
    Inventors: Nicholas J. Spiliotis, William R. Schevey, Donald W. Himler