Patents by Inventor Donald W. Schuenemann

Donald W. Schuenemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH DENSITY ELECTRICAL CONNECTOR ELEMENT AND ITS ASSOCIATED METHOD OF MANUFACTURE
    Publication number: 20020106913
    Abstract: A high density connector element and its associated method of manufacture. The high density connector element contains a plurality of conductive wires that are arranged in parallel on the top surface of a flexible substrate. To manufacture the high density connector element, the flexible substrate is coated with an adhesive and wrapped around a cylindrical drum with the adhesive facing outwardly. Conductive wire is then wound around the cylindrical drum in a helical pattern. The conductive wire is densely wrapped around the flexible substrate on the cylindrical drum and is bound by the adhesive, thereby creating the high density connector element. After the winding is complete and the adhesive cured, at least one strip is cut from the high density connector element. The high density connector element has a flexible substrate and multiple conductive wires laid in parallel across the top surface of the substrate.
    Type: Application
    Filed: February 5, 2001
    Publication date: August 8, 2002
    Inventors: Donald W. Schuenemann, George F. Glatts, III, Bruce C. Cobb, Robert J. Hickey
  • High density electrical connector
    Patent number: 6425180
    Abstract: A high density connector element and its associated method of manufacture. The high density connector element contains a plurality of conductive wires that are arranged in parallel on the top surface of a flexible substrate. To manufacture the high density connector element, the flexible substrate is coated with an adhesive and wrapped around a cylindrical drum with the adhesive facing outwardly. Conductive wire is then wound around the cylindrical drum in a helical pattern. The conductive wire is densely wrapped around the flexible substrate on the cylindrical drum and is bound by the adhesive, thereby creating the high density connector element. After the winding is complete and the adhesive cured, at least one strip is cut from the high density connector element. The high density connector element has a flexible substrate and multiple conductive wires laid in parallel across the top surface of the substrate.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: July 30, 2002
    Inventors: Donald W. Schuenemann, George F. Glatts, III, Bruce C. Cobb, Robert J. Hickey