Patents by Inventor Donald Wesley Henderson

Donald Wesley Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for transporting and clamping flexible film structures
    Patent number: 6024266
    Abstract: One or more porous air film rolls are used, in a system to support a flexible web during movement of the web, and selectively provide either compliant or rigid clamping of the web while performing processing operations on the web at a work station. The present invention is particularly suitable for punching holes on-the-fly, in both "X" and "Y" directions, in a flexible polyamide film. Up to a four-fold increase in punch tool productivity is provided by the present invention.
    Type: Grant
    Filed: October 28, 1998
    Date of Patent: February 15, 2000
    Assignee: International Business Machines Corporation
    Inventors: Edward Frank Helinski, Donald Wesley Henderson, David Erle Houser
  • System and method for transporting and clamping flexible film structures
    Patent number: 5957360
    Abstract: One or more porous air film rolls are used, in a system to support a flexible web during movement of the web, and selectively provide either compliant or rigid clamping of the web while performing processing operations on the web at a work station. The present invention is particularly suitable for punching holes on-the-fly, in both "X" and "Y" directions, in a flexible polyamide film. Up to a four-fold increase in punch tool productivity is provided by the present invention.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: September 28, 1999
    Assignee: International Business Machines Corporation
    Inventors: Edward Frank Helinski, Donald Wesley Henderson, David Erle Houser
  • Method and apparatus for establishing a solder bond to a solder ball grid array
    Patent number: 5902495
    Abstract: Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: May 11, 1999
    Assignee: International Business Machines Corporation
    Inventors: Edward J. Burke, Donald Wesley Henderson, Lawrence Philip Lehman, Daniel C. Webster, deceased