Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

Abstract: Integrated microphone and antennas include a microphone and an antenna. The microphone includes a housing and an acoustic transducer. The housing defines a cavity and includes a conductive layer. The acoustic transducer is positioned within the cavity and structured to generate an acoustic signal. The antenna is at least partially integrated with the microphone and structured to transmit and receive radio frequency signals. The antenna is structured to utilize the conductive layer of the housing as a radiating element.

Abstract: The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

Abstract: The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

Abstract: Integrated microphone and antennas include a microphone and an antenna. The microphone includes a housing and an acoustic transducer. The housing defines a cavity and includes a conductive layer. The acoustic transducer is positioned within the cavity and structured to generate an acoustic signal. The antenna is at least partially integrated with the microphone and structured to transmit and receive radio frequency signals. The antenna is structured to utilize the conductive layer of the housing as a radiating element.

Abstract: The present invention describes an apparatus capable of producing a radio frequency (RF) transmit (Tx) signal for a radiotelephone low enough in noise without requiring a post power amplifier (PA) cleanup filter.