Patents by Inventor Don Chul Choi
Don Chul Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240327746Abstract: Proposed is an aqueous suspension including water, a hexagonal boron nitride (hBN) particle, and a dispersant. A cutting fluid prepared by diluting the aqueous suspension with water is also proposed. The hexagonal boron nitride (hBN) particle is a hydrophilic particle that is wettable with water. The hexagonal boron nitride (hBN) particle has a particle size D50 of 30 to 250 nm and a particle size D90 of 1 um or less for a primary particle and a secondary particle through an application of ultrasound for 24 hours. The hexagonal boron nitride (hBN) particle is synthesized at a temperature of 1600° C. or lower. The hexagonal boron nitride (hBN) particle is mixed with water at a weight ratio of 10 or less, and the dispersant is mixed at a weight ratio of 10 or less.Type: ApplicationFiled: June 11, 2024Publication date: October 3, 2024Applicant: MICRO-COMPOSITE INC.Inventors: Don Chul CHOI, Yong Jin KIM
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Patent number: 10333358Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.Type: GrantFiled: May 9, 2018Date of Patent: June 25, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Seok Bae, Yu Seon Kim, Sang Hak Lee, Don Chul Choi, Soon Young Hyun
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Publication number: 20180262064Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.Type: ApplicationFiled: May 9, 2018Publication date: September 13, 2018Inventors: SEOK BAE, YU SEON KIM, SANG HAK LEE, DON CHUL CHOI, SOON YOUNG HYUN
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Patent number: 9997950Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.Type: GrantFiled: June 16, 2014Date of Patent: June 12, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Seok Bae, Yu Seon Kim, Sang Hak Lee, Don Chul Choi, Soon Young Hyun
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Publication number: 20180047505Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.Type: ApplicationFiled: October 23, 2017Publication date: February 15, 2018Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
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Patent number: 9831022Abstract: An embodiment of the present invention relates to a magnetic sheet having both an electromagnetic field shielding function and a heat dissipating function, and to a wirelessly charged magnetic member using same.Type: GrantFiled: October 8, 2014Date of Patent: November 28, 2017Assignee: LG INNOTEK CO., LTD.Inventors: So Yeon Kim, Seok Bae, Soon Young Hyun, Jai Hoon Yeom, Sang Won Lee, Hee Jung Lee, Don Chul Choi
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Patent number: 9825482Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.Type: GrantFiled: October 4, 2013Date of Patent: November 21, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
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Publication number: 20160268033Abstract: An embodiment of the present invention relates to a magnetic sheet having both an electromagnetic field shielding function and a heat dissipating function, and to a wirelessly charged magnetic member using same.Type: ApplicationFiled: October 8, 2014Publication date: September 15, 2016Applicant: LG INNOTECK CO. LTD.Inventors: So Yeon Kim, Seok Bae, Soon Young Hyun, Jai Hoon Yeom, Sang Won Lee, Hee Jung Lee, Don Chul Choi
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Publication number: 20150236545Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.Type: ApplicationFiled: October 4, 2013Publication date: August 20, 2015Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
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Patent number: 8068347Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.Type: GrantFiled: May 7, 2009Date of Patent: November 29, 2011Assignee: Samsung Electro-Mechanics Co., LtdInventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
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Patent number: 7843702Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.Type: GrantFiled: May 7, 2009Date of Patent: November 30, 2010Assignee: Samsung Electro-Mechanics Co., LtdInventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
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Patent number: 7663892Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.Type: GrantFiled: June 7, 2006Date of Patent: February 16, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
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Publication number: 20090268418Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.Type: ApplicationFiled: May 7, 2009Publication date: October 29, 2009Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
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Publication number: 20090268419Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.Type: ApplicationFiled: May 7, 2009Publication date: October 29, 2009Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon