Abstract: A method for transmitting and receiving data between an MPU and a memory operating in mutually different operating voltages in PLC is proposed, the method including: outputting, by the MPU, a CS (Chip Select) signal and an address signal in order to read data by approaching to the memory; outputting, by an OR gate, an activation signal for activating a data input buffer by receiving the CS signal and the address signal; outputting, by an access signal output buffer, a memory access signal for operation of the memory by receiving the CS signal and the address signal; outputting, by the memory, data requested by the MPU to the data input buffer by responding to the memory access signal; and outputting, by the data input buffer, the received data to the MPU by receiving the data outputted by the memory.

Abstract: A wafer test system includes an input device configured to transmit a test signal, a wafer including an optical port, an input port configured to receive the test signal, and an output port configured to output a result signal based on the test signal, a measuring device configured to measure the result signal, and an alignment device configured to align an optical fiber port of an optical probe with an alignment port based on the result signal and then align the optical fiber port with the optical port. The alignment port is the input port or the output port. The optical probe is configured to be the input device when the input port is the alignment port and the optical probe is configured to be the measuring device when the output port is the alignment port.

Abstract: A cutting tool and a cutting apparatus including a cutting tool. The cutting tool includes: a blade extending and reciprocating in a length direction of a workpiece for cutting the workpiece; at least one cutting tip provided on an end of the blade and protruding in a width direction of the blade for cutting the workpiece while contacting the workpiece; and an auxiliary cutting structure provided on at least one side of the blade and corresponding to a width of the cutting tip to prevent the blade from wobbling in a slot formed by the cutting tip. The cutting apparatus includes: a frame unit disposed at both sides of a workpiece in a cutting direction of the workpiece; and the cutting tool, the cutting tool configured to cut the workpiece while being reciprocated by power transmitted from a driving unit disposed on a side of the frame unit.

Abstract: A method of operating an image sensor includes: thermoelectrically cooling a pixel using a thermoelectric element having a thermoelectric-junction integrated to the pixel; and performing a photoelectric conversion operation using the thermoelectric element. An image sensor includes a pixel and a readout circuit. The pixel includes a thermoelectric element having a thermoelectric-junction, and the readout circuit is configured to control the pixel such that the thermoelectric element performs a thermoelectric-cooling operation and a photoelectric conversion operation.

Abstract: A method for measuring a concentration of an analyte in a bio-sample using an electrochemical bio-sensor according to an exemplary embodiment of the present invention is characterized by a step of obtaining predetermined features from induced currents obtained by applying a DC voltage according to chronoamperometry in which, after a whole blood sample is injected to the electrochemical bio-sensor, a concentration of an analyte is obtained from an induced current obtained by applying a DC voltage for a certain time and from all induced currents obtained by further applying several step-ladder perturbation potentials for a short time subsequent to the DC voltage for the certain time, and is also characterized by minimization of a measurement error caused by a hindering material by forming a calibration equation by combining the at least one feature in a function and optimizing various conditions of the bio-sample through Deleted Texts multivariable analysis.

Abstract: A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.

Abstract: A display device may include a display panel having a curved shape, a first printed circuit board and a second printed circuit board, at least one first carrier tape configured to connect the first printed circuit board to the display panel, at least one second carrier tape configured to connect the second printed circuit board to the display panel, and a connection unit configured to connect the first and second printed circuit boards to each other. A part of a layer of the connection unit may be a portion of a layer included in at least one of the first and second printed circuit boards.

Abstract: A method and apparatus for quantifying the vulnerability of a system. The apparatus includes a vulnerability calculation unit, a target organization security level calculation unit, a network separation status calculation unit, an interim calculation unit, and a final score calculation unit. The vulnerability calculation unit converts each of the vulnerability identification results of the system into a vulnerability score. The target organization security level calculation unit calculates a target organization security level score based on a technology-field security level score and a management-field security level score. The network separation status calculation unit converts the status of the separation of the local network of the system into a network separation score. The interim calculation unit calculates an interim score. The final score calculation unit quantifies the vulnerability of the system by finally calculating a composite score using the interim score and a simulated intrusion success level.

Abstract: A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.

Abstract: A method of operating a three-dimensional image sensor may include: obtaining position information of an object using light emitted by a light source module, the three-dimensional image sensor including the light source module having a light source and a lens; and adjusting a relative position of the light source to the lens based on the obtained position information of the object. A method of operating an image sensor may include: obtaining position information of an object using light emitted by a light source module, the image sensor including the light source module; and adjusting an emission angle of the light emitted by the light source module based on the obtained position information.

Abstract: A depth pixel includes a photo detection unit, an ambient light removal current source, a driving transistor and a select transistor. The photo detection unit is configured to generate a light current based on a received light reflected from a subject, the received light including an ambient light component. The ambient light removal current source configured to generate a compensation current indicating the ambient light component in response to a power supply and at least one compensation control signal. The driving transistor is configured to amplify an effective voltage corresponding to the light current and the compensation current. The select transistor configured to output the amplified effective voltage in response to a selection signal, the amplified effective voltage indicating a depth of the subject.

Abstract: In a method of operating an image sensor, a noise voltage of a floating diffusion region is sampled after a reset voltage is applied to the floating diffusion region. A storage region, in which a photo-charge is stored, is electrically connected to the floating diffusion region after sampling the noise voltage, and a demodulation voltage of the floating diffusion region is sampled after the storage region and the floating diffusion region are electrically-connected. A voltage is determined based on the noise voltage and the demodulation voltage.

Abstract: A backlight unit includes a light source unit which has a curved shape, a light guide plate including a curved light incident surface on which light emitted from the light source unit is incident, and a light source cover which has a curved shape corresponding to the curved light incident surface and is configured to surround one side of the light guide plate to dispose the light source unit and the light incident surface inside thereof. A groove is defined in the light source cover and extends toward the inside of the light source cover from an edge portion thereof.

Abstract: This invention relates to a Te-based thermoelectric material having stacking faults by addition of an interstitial dopant, including unit cells configured such that A-B-A-C-A elements are stacked to five layers, in which A element of a terminal of a unit cell and A element of a terminal of another unit cell are repeatedly stacked by a van der Waals interaction, wherein an interstitial element as the dopant is located at an interstitial position between the repeatedly stacked A elements adjacent to each other, thus generating stacking faults of the repeatedly stacked unit cells to thereby form a twin as well as a complex crystal structure different from the unit cells (where A is Te or Se, B is Bi or Sb, and C is Bi or Sb).

Abstract: A multi-layered non-volatile memory device and a method of manufacturing the same. The non-volatile memory device may include a plurality of first semiconductor layers having a stack structure. A plurality of control gate electrodes may extend across the first semiconductor layers. A first body contact layer may extend across the first semiconductor layers. A plurality of charge storage layers may be interposed between the control gate electrodes and the first semiconductor layers.

Abstract: A battery pack includes a first battery module, the first battery module including first unit batteries arranged side by side in a first direction, a second battery module adjacent to the first battery module, the second battery module including second unit batteries arranged side by side in the first direction, and at least one supporting block in a space between the first unit batteries and the second unit batteries, the at least one supporting block contacting the first and second battery modules.

Abstract: A motion sensing method is implemented by an image sensor, the image sensor including a first pixel and a second pixel. The method includes outputting a first pixel signal of the first pixel during a first integration time of a frame period, outputting a second pixel signal of the second pixel during a second integration time of the frame period, and generating comparison signals indicative of a sensed moving object by comparing the first pixel signal and the second pixel signal.

Abstract: Systems, apparatuses and methods for a service providing method are provided. The service providing system includes a display apparatus configured to transmit a request signal for a parameter required for moving image reproduction to a server apparatus, and the server apparatus configured to transmit the parameter parsed from a moving image stream to the display apparatus in response to the request signal for the parameter being received from the display apparatus, and transmit the moving image stream to the display apparatus in response to a moving image request signal being received from the display apparatus.

Abstract: The image sensor includes a pixel array including a plurality of unit pixels each including a single transistor and a photodiode connected to a body of the single transistor, a row driver block configured to enable one of a plurality of rows in the pixel array to enter a readout mode, and a readout block configured to sense and amplify a pixel signal output from each of a plurality of unit pixels included in the row that has entered the readout mode.

Abstract: A programmable logic controller (PLC) system, and more particularly, a data processing apparatus and method in the PLC system are provided. In the data processing method in a programmable logic controller (PLC) system, first dummy code data is output to an area having a chip selection signal for valid data output. The valid data is output after the first dummy code data is output. And second dummy code data is output when the valid data output is completed.