Abstract: Disclosed is laundry device having a steam generator (200), which prevents water from being excessively supplied to a case and steam generated from the case from adversely flowing toward a water supply valve (104), and removes overpressure due to steam generated in the case. A water oversupply prevention unit (220) for preventing the water from being excessively supplied to the case is a hollow floater, which moves vertically according to the amount of the water supplied to the case to open and close a water supply hole (211a). A backflow prevention unit (230) for preventing steam generated from the case from adversely flowing toward the water supply hole (211a) is a check valve, which allows the water to be supplied only to the inside of the case, prevents the steam generated from the case from flowing toward the water supply valve (104), and in installed between a water supply hole (211a) and the water supply valve (104).

Abstract: A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

Abstract: A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

Abstract: A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

Abstract: A PDP module packing apparatus includes PDP module packing units, each unit including a support member and a coupling unit for coupling a PDP module to a respective support member for supporting and preventing deformation of the PDP module; and shock absorbing units for receiving and supporting several PDP module packing units, a respective shock absorbing unit being locatable at each of upper and lower ends of the PDP module packing units and receiving one of the upper and lower ends for maintaining spacing between PDP module packing units, and absorbing mechanical shock. Thus, PDP modules can be safely shipped to a destination without receiving external vibration and shock in the PDP module packing apparatus.