Patents by Inventor Dong-Beop Lee

Dong-Beop Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7332691
    Abstract: A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the cooling plate to communicate with the exterior. Thus, an inner pressure of the space is maintained to be equal to an outer pressure thereof.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: February 19, 2008
    Assignee: Semes Co., Ltd.
    Inventors: Jin-Young Choi, Jun-Ho Ham, Tae-Su Kim, Dong-Beop Lee
  • Publication number: 20070090520
    Abstract: A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the cooling plate to communicate with the exterior. Thus, an inner pressure of the space is maintained to be equal to an outer pressure thereof.
    Type: Application
    Filed: November 16, 2005
    Publication date: April 26, 2007
    Inventors: Jin-Young Choi, Jun-Ho Ham, Tae-Su Kim, Dong-Beop Lee