Patents by Inventor Dong-Bin Kim
Dong-Bin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
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Patent number: 11957476Abstract: Disclosed is a method of identifying dementia by at least one processor of a device. The method includes performing a first task that causes a first object to be displayed on a first region of a screen displayed on a user terminal; and when a preset condition is satisfied, performing a second task that causes at least one object, which induces the user's gaze, to be displayed instead of the first object on the screen of the user terminal.Type: GrantFiled: November 23, 2022Date of Patent: April 16, 2024Assignee: HAII CO, LTD.Inventors: Ho Yung Kim, Bo Hee Kim, Dong Han Kim, Hye Bin Hwang, Chan Yeong Park, Ji An Choi
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Publication number: 20240120177Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.Type: ApplicationFiled: September 19, 2023Publication date: April 11, 2024Inventors: Ji Mo LEE, Dong Hyeon NA, Myeong Soo SHIN, Woong Jin CHEON, Kyung-Sun KIM, Jae Bin KIM, Tae-Hwa KIM, Seung Bo SHIM
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Publication number: 20240081722Abstract: A method of identifying dementia is disclosed that includes causing a user terminal to display an N-th screen including a plurality of objects. The user terminal may further display an N+1-th screen with the objects rearranged at positions on the N+1-th screen which are different from positions of the objects included in the N-th screen when an N-th selection input of selecting any one from among the objects included in the N-th screen is received. When an N+1-th selection input for selecting any one from among the objects included in the N+1-th screen is received, a third task of determining whether an answer of the N+1-th selection input is correct is performed based on whether the object selected from the N+1-th selection input is the same as at least one object selected from at least one previous selection input including the N-th selection input.Type: ApplicationFiled: July 7, 2022Publication date: March 14, 2024Applicant: HAII corp.Inventors: Ho Yung KIM, Geon Ha KIM, Bo Hee KIM, Dong Han KIM, Hye Bin HWANG, Chan Yeong PARK, Ji An CHOI, Bo Ri KIM
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Patent number: 11929032Abstract: A display device comprises a display panel which comprises scan lines, sensing lines, pixels electrically connected to each of the scan lines, and photo sensors electrically to each of the scan lines and the sensing lines, a scan driver which outputs scan signals to the scan lines according to a scan control signal, a timing controller which outputs the scan control signal to the scan driver, and a readout circuit which receives light sensing signals of the photo sensors from the sensing lines. The timing controller sets a frame frequency of the scan control signal to a first frame frequency in a first mode in which the display panel displays an image. The timing controller sets the frame frequency of the scan control signal to a second frame frequency in a second mode in which the photo sensors sense a fingerprint.Type: GrantFiled: August 15, 2022Date of Patent: March 12, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Hyun Dae Lee, Il Nam Kim, Seung Hyun Moon, Dong Wook Yang, Kang Bin Jo, Go Eun Cha
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Publication number: 20240066703Abstract: The present invention relates to a method and device for diagnosing a defect of a collaborative robot, the method comprising the steps in which: an electronic device generates a sensing data structure for managing sensing data collected from at least one collaborative robot; the electronic device generates an operation data structure for managing operation data associated with the operation of the collaborate robot; the electronic device generates a malfunction data structure for managing malfunction data of a point in which the severity of the operation equals to or is higher than a threshold; and the electronic device stores data collected from the at least one collaborative robot in accordance with the structures. Application to other embodiments is also possible.Type: ApplicationFiled: December 21, 2021Publication date: February 29, 2024Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Jung Won LEE, Ye Seul PARK, Dong Yeon YOO, Yang Gon KIM, Su Bin BAE
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Patent number: 7481351Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.Type: GrantFiled: August 30, 2004Date of Patent: January 27, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
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Publication number: 20050280503Abstract: A semiconductor wafer, comprising a radio frequency identification (RFID) chip on one side of the semiconductor wafer, on which a pattern has been formed, wherein information on the wafer is input to and/or output from the RFID chip using radio frequency communication.Type: ApplicationFiled: June 8, 2005Publication date: December 22, 2005Inventors: Sang-Woo Lee, Cheol-Joon Yoo, Dong-Bin Kim
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Publication number: 20050269713Abstract: An apparatus and method for wire bonding and die attaching using a system for determining reject frames by determining a z-level distance using a z-axis sensor are provided. The apparatus includes a z-axis sensor that may be moved between a reference position and an upper surface of frames on a PCB; a z-axis sensor controller for positioning and moving the z-axis sensor relative to the frame to measure the z-level distance between the reference position and a z-axis sensor contact position on an upper surface of the frame; and a host controller for determining whether the frame is a reject frame by comparing the measured z-level distance with a reference level. The apparatus and method provides for the dynamic determination of which frames are suitable for additional processing with a low error rate and thereby increase the exclusion rate for reject frames resulting in increased production capacity.Type: ApplicationFiled: February 2, 2005Publication date: December 8, 2005Inventors: Kook-Jin Oh, Dae-Soo Kim, Dong-Bin Kim, Suk-Chun Jung, Sang-Woo Lee, Byung-Soo Kim
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Publication number: 20050133563Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.Type: ApplicationFiled: August 30, 2004Publication date: June 23, 2005Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
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Patent number: 6578567Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.Type: GrantFiled: November 29, 2001Date of Patent: June 17, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Joung-Min Oh, Dong-Bin Kim, Sung-Hee Lee, Byeong-Soo Kim
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Publication number: 20020166428Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.Type: ApplicationFiled: November 29, 2001Publication date: November 14, 2002Applicant: Samsung Electronics Co., Ltd.Inventors: Joung-Min Oh, Dong-Bin Kim, Sung-Hee Lee, Byeong-Soo Kim