Patents by Inventor Dong Bo Yang

Dong Bo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160150644
    Abstract: The present disclosure relates to a resin composition, which serves as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, the resin composition including: a rubber-modified epoxy resin; an epoxy resin; an inorganic filler; and a curing agent.
    Type: Application
    Filed: October 2, 2013
    Publication date: May 26, 2016
    Applicant: DOOSAN CORPORATION
    Inventors: Hang Seok LEE, Duk Sang HAN, Yoon Ho JUNG, Dong Bo YANG
  • Patent number: 8809688
    Abstract: Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: August 19, 2014
    Assignee: Doosan Corporation
    Inventors: Yang Seob Kim, Won Kyum Kim, Hyung Wan Kim, Dong Bo Yang
  • Publication number: 20120085570
    Abstract: Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.
    Type: Application
    Filed: April 2, 2010
    Publication date: April 12, 2012
    Applicant: Doosan Corporation
    Inventors: Yang Seob Kim, Won Kyum Kim, Hyung Wan Kim, Dong Bo Yang
  • Publication number: 20120018197
    Abstract: Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.
    Type: Application
    Filed: January 22, 2010
    Publication date: January 26, 2012
    Applicant: DOOSAN CORPORATION
    Inventors: Young Seok Park, Eun Song Baik, Yang Seob Kim, Dong Bo Yang