Abstract: A display device includes a plurality of pixels arranged in a display area of a display panel, and a display driving circuit supplying data voltages and pixel driving control signals to the plurality of pixels to control an image display operation for each of the plurality of pixels. The display driving circuit further supplies an active control voltage that varies proportional to or inversely proportional to a change in temperature of the display panel to at least one thin film transistor included in the plurality of pixels.

Abstract: The present invention relates to a building information modeling (BIM) operation management method, and more specifically, to a BIM operation program that can provide improved convenience to a user by directly viewing and checking data on a structure within a BIM 3D model management program without viewing a separate auxiliary program, and that allows simultaneous cross-editing by linking with a spreadsheet or document creation program where structure data is input when editing data in the BIM 3D model management program.

Abstract: Provided is a collector including an adhesion enhancing layer capable of providing a positive electrode having excellent adhesion and low interfacial resistance, a positive electrode including the same, and a lithium secondary battery including the positive electrode. The collector includes a conductive metal layer, and an adhesion enhancing layer provided on at least one surface of the conductive metal layer, wherein the adhesion enhancing layer has a surface roughness (Ra) of 90 nm to 600 nm and a diiodomethane contact angle of 70° to 120°.

Abstract: The ring assembly for a substrate processing apparatus, in which a plasma process is performed, of the present invention comprises an inner ring, in which a first plasma region is formed, an outer ring provided outside the inner ring, in which a second plasma region with a lower plasma distribution than the first plasma region is formed, and a cover ring provided on an upper surface of the outer ring, having a thickness smaller than that of the inner ring, and made of a material that has a lower etching reaction to plasma than the outer ring.

Abstract: A lower cross member for a vehicle is disposed on a floor of a vehicle. The lower cross member includes a core member and a reinforcing layer. The core member is made of a composite material containing 70 wt. % or more of unidirectional carbon fibers, and the reinforcing layer is made of a composite material containing 70 wt. % or more of fiberglass.

Abstract: An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

Abstract: The present invention relates to a method for improving muscle strength, and/or muscle mass by administering a composition containing as an active ingredient at least one selected from the group consisting of Akkermansia muciniphila cells, a culture thereof and a lysate thereof, and a method for preventing or treating muscle diseases where muscle strength and/or mass is weakened by sarcopenia, cachexia or muscle wasting.

Abstract: A semiconductor device includes a substrate including a first region and a second region, fin type active areas extending in a first direction away from the substrate in each of the first and second regions, a plurality of nanosheets extending parallel to an upper surface of the fin type active areas and being spaced apart from the upper surface of the fin type active areas, a gate extending over the fin type active areas in a second direction crossing the first direction, a gate dielectric layer interposed between the gate and each of the nanosheets, first source and drain regions included in the first region and second source and drain regions included in the second region, and insulating spacers interposed between the fin type active areas and the nanosheets, wherein air spacers are interposed between the insulating spacers and the first source and drain regions.

Abstract: A cutting device for a bone fixing plate having a multipurpose bite for easily bending bone in the shape of a hook while reducing the size of a fixing plate for fixing fractured bone to each other. Curved surface cutting and V-shape cutting can be performed using one cutting device, thereby reducing the number of equipment, shortening surgery time, and generating a strong holding force at the time of bending to enable precise cutting.

Abstract: A semiconductor device includes a drain, a source, a gate electrode, and a nanowire between the source and drain. The nanowire has a first section with a first thickness and a second section with a second thickness greater than the first thickness. The second section is between the first section and at least one of the source or drain. The first nanowire includes a channel when a voltage is applied to the gate electrode.

Abstract: An organic light-emitting display device includes: a display panel having a first display area and a second display area, the first and second display areas having different light transmittances from each other in a unit area, wherein the display panel includes a plurality of organic light-emitting diodes disposed in the first display area and the second display area, wherein a first organic light-emitting diode disposed in the first display area and a second organic light-emitting diode disposed in the second display area each include at least one light emitter, and the number of the light emitter included in the second organic light-emitting diode is greater than the number of the light emitter included in the first organic light-emitting diode.

Abstract: A display device comprises a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including a second contact hole, a fan-out line disposed in a first metal layer on the first barrier insulating layer, the fan-out line including a protruding part inserted in the second contact hole to protrude from below the first barrier insulating layer, and a recessed part formed by the second contact hole, an etching electrode disposed in the recessed part of the fan-out line, a second substrate disposed on the fan-out line and the etching electrode and including a third contact hole, a display layer disposed on the second substrate, and a flexible film disposed below the first substrate and inserted in the first contact hole to be electrically connected to the protruding part of the fan-out line.

Abstract: The present invention relates to an antibody against resistin and use thereof and, more specifically, to a resistin antibody or antigen-binding fragment thereof that inhibits the activity of resistin by blocking resistin/CAP1 binding, a nucleic acid encoding same, a vector comprising the nucleic acid, a cell transformed with the vector, a method for preparing the antibody or antigen-binding fragment thereof, an antibody-drug conjugate comprising the antibody or antigen-binding fragment thereof, a bi- or multi-specific antibody, a chimeric antigen receptor, an immune cell containing same, and a composition for the prevention or treatment of diseases that can be treated through the inhibition of resistin activity, the composition comprising same.

Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.

Abstract: A light emitting device may include a first electrode, a first light emitting stack disposed on the first electrode, a charge generation layer disposed on the first light emitting stack, a second light emitting stack disposed on the charge generation layer, and a second electrode disposed on the second light emitting stack. Each of the first light emitting stack and the second light emitting stack includes a hole transport layer. A hole mobility of the charge generation layer is lower than a hole mobility of the hole transport layer.

Abstract: The present disclosure relates to an electrode rolling apparatus including a non-coating portion pressing unit that rolls a non-coating portion of an electrode substrate and an electrode rolling method using the same, and can prevent a swell from occurring in the non-coating portion region during the process of rolling the electrode substrate and increase the efficiency of the manufacturing process.

Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: An organic light emitting diode, including a first electrode; a second electrode facing the first electrode, the second electrode including magnesium; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, the electron injection layer including a dipole material including a first component and a second component having different polarities, the dipole material including halide, and a content of the magnesium included in the second electrode being in a range of from 10 to 40 volume %.

Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.