Abstract: A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Abstract: A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A molding apparatus for semiconductor package includes: a lower mold supporting a first semiconductor chip; a middle mold positioned over the lower mold and supporting a second semiconductor chip, and having a first cavity for molding the first semiconductor chip on a lower surface facing the lower mold; an upper mold positioned over the middle mold and having a second cavity for molding the second semiconductor chip on a lower surface facing the middle mold; a first supply port penetrating the lower mold and connected to the first cavity; a second supply port penetrating the lower and middle molds and connected to the second cavity; and a pressure unit positioned under the lower mold and including first and second transfer rams provided respectively in the first and second supply ports to pressure molding compound therein to supply the molding compound into the first and second cavities.

Abstract: A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Abstract: An equipment and method to classify semiconductor packages diced on a substrate into defective and non-defective semiconductor packages includes a loading preparation table to receive a plurality of semiconductor packages to be inspected, a first inspection unit to inspect and classify the semiconductor packages received at the loading preparation table into normal semiconductor packages and defective semiconductor packages, a temporary loading table to temporarily receive at least a portion of the normal semiconductor packages, a first loading picker to transfer the defective semiconductor packages from the loading preparation table to a defective package loading tray and to transfer the normal semiconductor packages from the temporary loading table to the loading preparation table, and a second loading picker to transfer the normal semiconductor packages from the loading preparation table to a normal package loading tray.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A thrust magnetic bearing system separates magnetic circuits of electromagnets from those of permanent magnets so that each permanent magnet produces a bias magnetic field while each electromagnet functions only to control the position of a rotating body, thereby achieving desired displacement and current stiffness without flowing a bias current through the electromagnet. The magnetic bearing system includes a thrust displacement sensor and a thrust magnetic bearing to float a disk floating body based on displacement information detected through the displacement sensor. The magnetic bearing includes a donut permanent magnet, a pair of electromagnets connected in series to form an inductor at both sides of the donut permanent magnet, and a pair of magnetic poles provided opposite each other outside the pair of electromagnets. The magnetic bearing floats the floating body through a bias magnetic flux generated by the permanent magnet and a control magnetic flux generated by the electromagnets.

Abstract: A computer-controlled training apparatus for spine-stabilizing musculature is designed to tilt an upstanding user by a predetermined angle in accordance with a training program recorded in a computer so as to cause a reflexive movement for the user based on the human body's sense of balance for maintaining posture. The training device for spine-stabilizing musculature includes a base stand, a pitching unit having a pitching plate installed above the base stand in a vertically pivotally rotatable manner, a rolling unit having a rolling plate rotatably coupled to the pitching unit, a securing unit mounted to the rolling unit for securing the user's body at a fixed position, and a cover for preventing the pitching unit and a part of the rolling unit below the rolling plate from being exposed to the outside.

Abstract: Disclosed herein is a plate type capacitive sensor for five-dimensional displacement measurement that is capable of simultaneously measuring five-dimensional movement of an object, which includes the horizontal movement, the vertical movement, and the tilt of the object. The plate type capacitive sensor for five-dimensional displacement measurement comprises a plate located adjacent to an object to be measured, and a ground part, a first guard part, a displacement measuring sensor, and a second guard part, which are stacked on the plate in consecutive order. The plate may be made by machining or made of a printed circuit board (PCB).

Abstract: In one embodiment of a system for sensing the shape of a chip, a support plate is provided that preferably includes at least one chip mounted thereon. A lower lighting unit is preferably disposed below the support plate to emit light through the support plate and around or between the chip(s) toward an optical sensing unit, with a portion of the light emitted being blocked by the opaque chip(s). The optical sensing unit preferably senses the light that passes through the support plate and around or between the chip(s), but not the light that is blocked by the chip(s). In this manner, the shape of the chip can be more accurately determined, even when it is deformed within an acceptable range. A method for using a system constructed according to the principles of the present invention is also provided.

Abstract: Disclosed herein is a plate type capacitive sensor for five-dimensional displacement measurement that is capable of simultaneously measuring five-dimensional movement of an object, which includes the horizontal movement, the vertical movement, and the tilt of the object. The plate type capacitive sensor for five-dimensional displacement measurement comprises a plate located adjacent to an object to be measured, and a ground part, a first guard part, a displacement measuring sensor, and a second guard part, which are stacked on the plate in consecutive order. The plate may be made by machining or made of a printed circuit board (PCB).

Abstract: A linear EMV actuator uses a permanent magnet and an electromagnet in which EMV operation for opening/closing an exhaust valve and an intake valve makes valve operations linear. As a result, the valve undergoes a soft landing and active control of an amount of opening of the valve. The linear EMV actuator includes an upper core and a lower core, an armature, an actuator spring and a valve spring. Also included are a permanent magnet, an upper coil and a lower coil connected to each other in series thereby forming one electromagnet, a displacement sensor, and a position controller.

Abstract: A capacitive sensor for simultaneously sensing radial movement and axial movement of a rotary body. The capacitive sensor includes a sensor housing having a pocket disposed in a radial direction and provided with one side surface opened in an axial direction; a plurality of sensor electrodes inserted into the pocket; and an insulator inserted into the pocket to fill a space between the sensor housing and the sensor electrodes. Each of the sensor electrodes includes a radial sensor plane and an axial sensor plane, and the capacitive sensor further includes a guard formed between the sensor electrodes and the sensor housing.

Abstract: Disclosed herein is a muscular motion simulating system that is capable of simulating a force-displacement characteristic of an ideal muscle model through the use of a large displacement magnetic actuating unit supported by means of linear springs.

Abstract: An artificial heart blood pump including a driving motor which can be contained within the human body and which performs pumping action when supplied from an electric power source from outside of the human body. The pump includes left and right ventricles defined by elastomeric films fixed inside a pump body near each side. Each ventricle has an inlet and an outlet provided with respective check valves. Within the pump body generally between the elastomeric films is a movable body having a cylindrical case with a bidirectional driving motor built in. The movable body rolls from side to side during operation to alternately press against the elastomeric films and discharge blood alternately from the ventricles.