Abstract: A method of forming a metal wiring for a semiconductor device includes forming a metal-based layer on a substrate, the substrate including at least one conductive structure, forming a metal seed layer on the metal-based layer, forming a supplementary contact layer on the metal seed layer along peripheral portions of the substrate, the metal seed layer being between the substrate and the supplementary contact layer, and the supplementary contact layer including a supplementary metal having an electrical resistance smaller than or equal to an electrical resistance of the metal seed layer, loading the substrate into a plating apparatus, such that the supplementary contact layer is being in direct contact with the cathode of the plating apparatus, and performing an electroplating process on the metal seed layer to form a metal wiring layer on the metal-based layer.

Abstract: A method of removing an insulation layer pattern covering metal wires includes providing an insulation layer pattern on a substrate, the insulation layer pattern having openings exposing the substrate, forming metal wires in the openings by depositing a barrier layer on inner surfaces of the openings, such that a lower portion of the barrier layer is thinner that an upper portion of the barrier layer, and depositing a metal layer to fill the openings, and performing an etching process with an etching vapor to remove the insulation layer pattern from the substrate to expose the metal wires.

Abstract: There is provided a cleaning solution spraying unit. The cleaning solution spraying unit comprises a number of nozzles installed in a nozzle base, along a top surface of a wafer, and radially spraying a cleaning solution on the wafer, wherein the nozzle base is positioned above the wafer; and a power unit rotating the nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer. In addition, provided is a wafer cleaning apparatus including the cleaning solution spraying unit with the above-described constitution.