Patents by Inventor Dong-Chul Pyun

Dong-Chul Pyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100015472
    Abstract: Encapsulated particles and methods for manufacturing encapsulated particles and structures are described. Such particles may have a length no greater than 40 nm, and include at least one material selected from the group consisting of ferromagnetic materials and ferrimagnetic materials. A polymeric encapsulant surrounds the particle, the polymeric encapsulant including a phase-separated block copolymer including a glassy first phase and a rubbery second phase, the glassy first phase positioned between the particle and the second rubbery phase. The glassy first phase includes a hydrophobic copolymer having a glass transition temperature of at least 50° C. The rubbery second phase includes a polymer having at least one of (i) a glass transition temperature of no greater than 30° C., and (ii) a tan delta peak maximum of no greater than 30° C. Other embodiments are described and claimed.
    Type: Application
    Filed: July 16, 2008
    Publication date: January 21, 2010
    Inventors: Richard Lionel Bradshaw, Dong-Chul Pyun