Patents by Inventor Dong Chun Park
Dong Chun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12247749Abstract: An air conditioning system is provided with an integrated heat exchanger. The air conditioning system generates heating air or cooling air through the integrated heat exchanger that adjusts the temperature of conditioning air by circulating coolant, thus securing cooling and heating efficiency. The air conditioning system adjusts temperature by the coolant circulated in the integrated heat exchanger such that a temperature adjustment door for adjusting the temperature of the conditioning air is eliminated, the number of components is decreased, and the size of an overall package is reduced.Type: GrantFiled: November 18, 2022Date of Patent: March 11, 2025Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Hanon SystemsInventors: Kwang Ok Han, Gee Young Shin, Su Yeon Kang, Dong Ho Kwon, Myung Hoe Kim, Dae Hee Lee, In Jae Kang, Tae Young Park, Jae Chun Ryu
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Publication number: 20250081673Abstract: A display device includes a first electrode and a second electrode spaced apart from each other, and light emitting elements disposed between the first electrode and the second electrode. Each of the light emitting elements include a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer. Each of the light emitting elements emits light with a wavelength in a range of about 464 nm to about 468 nm at a current density in a range of about 0.5 A/cm2 to about 100 A/cm2, and has a maximum external quantum efficiency greater than or equal to about 15%.Type: ApplicationFiled: August 29, 2024Publication date: March 6, 2025Applicant: Samsung Display Co., LTD.Inventors: So Young LEE, Bong Chun PARK, Kwan Jae LEE, Dong Eon LEE, Seung A LEE, Jong Jin LEE
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Publication number: 20220182769Abstract: A MEMS microphone includes a substrate including a vibration area defining a cavity, a supporting area surrounding the vibration area, and a peripheral area surrounding the supporting area, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being spaced apart from the substrate to be configured to sense an acoustic pressure to generate a corresponding displacement, an anchor completely surrounding an end portion of the diaphragm, the anchor being fixed to an upper surface of the substrate to support the diaphragm from the substrate, and a back plate disposed over the diaphragm and in the vibration area, and the back plate being spaced apart from the diaphragm to form an air gap and having a plurality of acoustic holes.Type: ApplicationFiled: December 7, 2021Publication date: June 9, 2022Inventor: Dong Chun PARK
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Patent number: 11259125Abstract: A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.Type: GrantFiled: April 7, 2020Date of Patent: February 22, 2022Assignee: DB HITEK CO., LTD.Inventors: Han Choon Lee, Hyeok In Kwon, Jong Won Sun, Dong Chun Park, Ye Eun Na
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Publication number: 20200322732Abstract: A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.Type: ApplicationFiled: April 7, 2020Publication date: October 8, 2020Inventors: Han Choon LEE, Hyeok In KWON, Jong Won SUN, Dong Chun PARK, Ye Eun NA
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Patent number: 10785557Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.Type: GrantFiled: June 13, 2017Date of Patent: September 22, 2020Assignee: DB HITEK CO., LTD.Inventors: Dong Chun Park, Han Choon Lee
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Patent number: 10544038Abstract: A MEMS microphone includes a substrate having a cavity, a back plate provided over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and spaced apart from the substrate and the back plate, a strut located at outer side of the diaphragm, having a lower surface in contact with an upper surface of the substrate and being integrally formed with the upper insulation layer to support the upper insulation layer to space the upper insulation layer from the diaphragm, and a bending prevention member provided on an upper surface of the back plate for preventing the back plate from being bent.Type: GrantFiled: August 7, 2018Date of Patent: January 28, 2020Assignee: DB HITEK CO., LTD.Inventors: Dong Chun Park, Jong Won Sun
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Publication number: 20190047849Abstract: A MEMS microphone includes a substrate having a cavity, a back plate provided over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and spaced apart from the substrate and the back plate, a strut located at outer side of the diaphragm, having a lower surface in contact with an upper surface of the substrate and being integrally formed with the upper insulation layer to support the upper insulation layer to space the upper insulation layer from the diaphragm, and a bending prevention member provided on an upper surface of the back plate for preventing the back plate from being bent.Type: ApplicationFiled: August 7, 2018Publication date: February 14, 2019Inventors: Dong Chun PARK, Jong Won SUN
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Publication number: 20170359648Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.Type: ApplicationFiled: June 13, 2017Publication date: December 14, 2017Inventors: Dong Chun Park, Han Choon Lee