Patents by Inventor Dong D. Wang

Dong D. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesives, adhesive layers for electroless plating and printed circuit boards
    Patent number: 5519177
    Abstract: An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
    Type: Grant
    Filed: May 16, 1994
    Date of Patent: May 21, 1996
    Assignee: IBIDEN Co., Ltd.
    Inventors: Dong D. Wang, Motoo Asai