Patents by Inventor Dong Eun SON

Dong Eun SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11497116
    Abstract: A flexible circuit board is provided. The flexible circuit board includes a base film with an outer lead region defined on either one surface or the other surface and an outer lead provided in the outer lead region and connected to an electronic device, in which the outer lead includes a plurality of first outer leads and a plurality of second outer leads formed to be spaced apart from each other so as to face each other in the outer lead region, and in which the number of the plurality of first outer leads is greater than the number of the plurality of second outer leads.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: November 8, 2022
    Assignee: STEMCO CO., LTD.
    Inventors: Jin Han Lee, Sung Bin Park, Hiroo Shimizu, Dong Eun Son
  • Publication number: 20200375028
    Abstract: A flexible circuit board is provided. The flexible circuit board includes a base film with an outer lead region defined on either one surface or the other surface and an outer lead provided in the outer lead region and connected to an electronic device, in which the outer lead includes a plurality of first outer leads and a plurality of second outer leads formed to be spaced apart from each other so as to face each other in the outer lead region, and in which the number of the plurality of first outer leads is greater than the number of the plurality of second outer leads.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Applicant: STEMCO CO., LTD.
    Inventors: Jin Han LEE, Sung Bin PARK, Hiroo SHIMIZU, Dong Eun SON