Abstract: The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.

Abstract: There is provided a radar apparatus comprising: a substrate; multiple antenna elements mounted on the substrate; and a signal-coupling suppressor disposed between the multiple antenna elements.

Abstract: The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.

Abstract: There is provided a radar apparatus comprising: a substrate; multiple antenna elements mounted on the substrate; and a signal-coupling suppressor disposed between the multiple antenna elements.

Abstract: Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

Abstract: A spread spectrum clock generator includes a plurality of delay cells, wherein each delay cell includes at least one delayer receiving an external clock signal and causing a predetermined propagation delay to the received clock signal, and a controller transmitting a control signal to the delayer to control the propagation delay of the delayer according to a state value of the control signal. With this configuration, the spread spectrum clock generator using a delayer can have a simple circuit configuration and effectively attenuate an EMI.

Abstract: A spread spectrum clock generator includes a plurality of delay cells, wherein each delay cell includes at least one delayer receiving an external clock signal and causing a predetermined propagation delay to the received clock signal, and a controller transmitting a control signal to the delayer to control the propagation delay of the delayer according to a state value of the control signal. With this configuration, the spread spectrum clock generator using a delayer can have a simple circuit configuration and effectively attenuate an EMI.